Journal
ACS BIOMATERIALS SCIENCE & ENGINEERING
Volume 7, Issue 10, Pages 4694-4717Publisher
AMER CHEMICAL SOC
DOI: 10.1021/acsbiomaterials.1c00598
Keywords
Bio-AM; scaffolds; defects; material rheology; 3D printing; tissue engineering
Categories
Funding
- National Science Foundation [NSF CMMI-1719388, CMMI-1739696, CMMI-1752069]
- National Institutes of Health [AR073822]
- University of Nebraska-Lincoln
- Nebraska Tobacco Settlement Biomedical Research Enhancement Funds
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Biological additive manufacturing (Bio-AM) is a promising method for fabricating biological scaffolds with nano- to microscale resolutions and biomimetic architectures beneficial to tissue engineering applications. However, flaws introduced during fabrication can affect mechanical properties and lead to unpredictable biological responses from cells interacting with the defective scaffolds.
Biological additive manufacturing (Bio-AM) has emerged as a promising approach for the fabrication of biological scaffolds with nano- to microscale resolutions and biomimetic architectures beneficial to tissue engineering applications. However, Bio-AM processes tend to introduce flaws in the construct during fabrication. These flaws can be traced to material nonhomogeneity, suboptimal processing parameters, changes in the (bio)-printing environment (such as nozzle clogs), and poor construct design, all with significant contributions to the alteration of a scaffold's mechanical properties. In addition, the biological response of endogenous and exogenous cells interacting with the defective scaffolds could become unpredictable. In this review, we first described extrusion-based Bio-AM. We highlighted the salient architectural and mechanotransduction parameters affecting the response of cells interfaced with the scaffolds. The process phenomena leading to defect formation and some of the tools for defect detection are reviewed. The limitations of the existing developments and the directions that the field should grow in order to overcome said limitations are discussed.
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