Related references
Note: Only part of the references are listed.Interconnect Fabrication on Polymer Substrate using Submicron/Nano Silver Particles with the Assistance of Low-Density Irradiations
Guo-Lun Huang et al.
JOM (2019)
Green laser sintering of copper oxide (CuO) nano particle (NP) film to form Cu conductive lines
Md Khalilur Rahman et al.
AIP ADVANCES (2018)
Development of Cu-Ag pastes for high temperature sustainable bonding
Ching-Huan Hsiao et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2017)
Effect of copper oxide shell thickness on flash light sintering of copper nanoparticle ink
Gyung-Hwan Oh et al.
RSC ADVANCES (2017)
Low-Thermal-Budget Photonic Processing of Highly Conductive Cu Interconnects Based on CuO Nanoinks: Potential for Flexible Printed Electronics
Matthew S. Rager et al.
ACS APPLIED MATERIALS & INTERFACES (2016)
Two-step flash light sintering of copper nanoparticle ink to remove substrate warping
Chung-Hyeon Ryu et al.
APPLIED SURFACE SCIENCE (2016)
Kinetic study on low temperature coalescence of carboxylate-protected Ag nanoparticles for interconnect applications
Jenn-Ming Song et al.
RSC ADVANCES (2016)
All-photonic drying and sintering process via flash white light combined with deep-UV and near-infrared irradiation for highly conductive copper nano-ink
Hyun-Jun Hwang et al.
SCIENTIFIC REPORTS (2016)
Direct Intense Pulsed Light Sintering of Inkjet-Printed Copper Oxide Layers within Six Milliseconds
Hyunkyoo Kang et al.
ACS APPLIED MATERIALS & INTERFACES (2014)
Highly conductive copper nano/microparticles ink via flash light sintering for printed electronics
Sung-Jun Joo et al.
NANOTECHNOLOGY (2014)
Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid
Wen-Hua Li et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2014)
Photosintering and electrical performance of CuO nanoparticle inks
Chantal Paquet et al.
ORGANIC ELECTRONICS (2014)
Cu Ion Ink for a Flexible Substrate and Highly Conductive Patterning by Intensive Pulsed Light Sintering
Byung-Yong Wang et al.
ACS APPLIED MATERIALS & INTERFACES (2013)
Cu Salt Ink Formulation for Printed Electronics using Photonic Sintering
Teppei Araki et al.
LANGMUIR (2013)
In situ monitoring of a flash light sintering process using silver nano-ink for producing flexible electronics
Wan-Ho Chung et al.
NANOTECHNOLOGY (2013)
Nanosized induced low-temperature alloying in binary and ternary noble alloy systems for micro-interconnect applications
Tzu-Hsuan Kao et al.
ACTA MATERIALIA (2011)
Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics
Jongeun Ryu et al.
JOURNAL OF ELECTRONIC MATERIALS (2011)
Sintering of Inkjet-Printed Silver Nanoparticles at Room Temperature Using Intense Pulsed Light
J. S. Kang et al.
JOURNAL OF ELECTRONIC MATERIALS (2011)
Direct Inkjet Printing of Silver Nitrate/Poly(N-vinyl-2-pyrrolidone) Inks To Fabricate Silver Conductive Lines
Jung-Tang Wu et al.
JOURNAL OF PHYSICAL CHEMISTRY C (2010)
Intense pulsed light sintering of copper nanoink for printed electronics
Hak-Sung Kim et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2009)
Photocatalyzed degradation of polymers in aqueous semiconductor suspensions V. Photomineralization of lactam ring-pendant polyvinylpyrrolidone at titania/water interfaces
S Horikoshi et al.
JOURNAL OF PHOTOCHEMISTRY AND PHOTOBIOLOGY A-CHEMISTRY (2001)