Journal
NANOMATERIALS
Volume 11, Issue 8, Pages -Publisher
MDPI
DOI: 10.3390/nano11081898
Keywords
sandwich epoxy-based composites; aluminium nitride; dielectric properties; thermal conductivity
Categories
Funding
- Qingchuang Talents Induction Program of Shandong Higher Education Institution
- Natural Science Foundation of Shandong Province [ZR2019YQ24]
- Science Foundation of Shaanxi Provincial Department of Education [17JS076]
- Xi'an Key Lab-oratory of Clean Energy [2019219914SYS014CG036]
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This study successfully prepared novel sandwich AlN/epoxy composites with significantly enhanced dielectric breakdown strength and thermal conductivity, showing great potential for application in power electronic devices and power equipment. The optimized sandwich composite with specific layer thicknesses demonstrated high through-plane thermal conductivity and dielectric breakdown strength, making it promising for various industrial applications.
Polymer-based composites with high thermal conductivity and dielectric breakdown strength have gained increasing attention due to their significant application potential in both power electronic devices and power equipment. In this study, we successfully prepared novel sandwich AlN/epoxy composites with various layer thicknesses, showing simultaneously and remarkably enhanced dielectric breakdown strength and thermal conductivity. The most optimized sandwich composite, with an outer layer thickness of 120 mu m and an inner layer thickness of 60 mu m (abbreviated as 120-60) exhibits a high through-plane thermal conductivity of 0.754 W/(m center dot K) (4.1 times of epoxy) and has a dielectric breakdown strength of 69.7 kV/mm, 8.1% higher compared to that of epoxy. The sandwich composites also have higher in-plane thermal conductivity (1.88 W/(m center dot K) for 120-60) based on the novel parallel models. The sandwich composites with desirable thermal and electrical properties are very promising for application in power electronic devices and power equipment.
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