Journal
MICROMACHINES
Volume 12, Issue 7, Pages -Publisher
MDPI
DOI: 10.3390/mi12070776
Keywords
metal-assisted etching; metal-assisted catalytic etching; silicon nanowires; porous silicon; porous powders; metal nanoparticles; deposition
Categories
Funding
- National Science Foundation [1825331]
- Pennsylvania State System of Higher Education Technology Fee Program
- Div Of Civil, Mechanical, & Manufact Inn
- Directorate For Engineering [1825331] Funding Source: National Science Foundation
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The electroless etching of semiconductors has become an advanced microfabrication process with the addition of structured metal catalysts. This technique allows for the precise patterning of wafer substrates and the production of nanoparticles, leading to the creation of porous structures and nanostructured powders. Metal-assisted catalytic etching can be controlled to produce various pore structures in substrates and nanowires with different core compositions.
Electroless etching of semiconductors has been elevated to an advanced micromachining process by the addition of a structured metal catalyst. Patterning of the catalyst by lithographic techniques facilitated the patterning of crystalline and polycrystalline wafer substrates. Galvanic deposition of metals on semiconductors has a natural tendency to produce nanoparticles rather than flat uniform films. This characteristic makes possible the etching of wafers and particles with arbitrary shape and size. While it has been widely recognized that spontaneous deposition of metal nanoparticles can be used in connection with etching to porosify wafers, it is also possible to produced nanostructured powders. Metal-assisted catalytic etching (MACE) can be controlled to produce (1) etch track pores with shapes and sizes closely related to the shape and size of the metal nanoparticle, (2) hierarchically porosified substrates exhibiting combinations of large etch track pores and mesopores, and (3) nanowires with either solid or mesoporous cores. This review discussed the mechanisms of porosification, processing advances, and the properties of the etch product with special emphasis on the etching of silicon powders.
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