Dry Film Resist Laminated Microfluidic System for Electrical Impedance Measurements

In micro-electrical-mechanical systems (MEMS), thick structures with high aspect ratios are often required. Dry film photoresist (DFR) in various thicknesses can be easily laminated and patterned using standard UV lithography. Here, we present a three-level DFR lamination process of SUEX for a microfluidic chip with embedded, vertically arranged microelectrodes for electrical impedance measurements. To trap and fix the object under test to the electrodes, an aperture is formed in the center of the ring-shaped electrodes in combination with a microfluidic suction channel underneath. In a proof-of-concept, the setup is characterized by electrical impedance measurements with polystyrene and ZrO2 spheres. The electrical impedance is most sensitive at approximately 2 kHz, and its magnitudes reveal around 200% higher values when a sphere is trapped. The magnitude values depend on the sizes of the spheres. Electrical equivalent circuits are applied to simulate the experimental results with a close match.

Automated summary

A three-level DFR lamination process using SUEX for a microfluidic chip with vertically arranged microelectrodes for electrical impedance measurements is presented. The setup traps and fixes objects under test to the electrodes using an aperture in the center of ring-shaped electrodes and a microfluidic suction channel. The electrical impedance measurements show higher values when spheres are trapped, with the magnitude depending on the sizes of the spheres.