4.4 Article

Entropy stabilized off-stoichiometric cubic γ-Cu1-xIx phase containing high-density Cu vacancies

Journal

AIP ADVANCES
Volume 11, Issue 9, Pages -

Publisher

AIP Publishing
DOI: 10.1063/5.0060622

Keywords

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Funding

  1. Basic Science Research Program through the National Research Foundation of Korea (NRF) - Ministry of Education [NRF-2019R1I1A1A01040351]
  2. Korea Electrotechnology Research Institute (KERI) Primary Research Program through the National Research Council of Science and Technology (NST) - Ministry of Science and ICT (MSIT) of the Republic of Korea [21A01003]
  3. National Research Council of Science & Technology (NST), Republic of Korea [21A01003] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)

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The study found that in copper-rich conditions, nearly stoichiometric phases of copper iodide with quenched copper-vacancy defects are the ground state, while in iodine-rich conditions, off-stoichiometric phases containing high-density copper vacancies are stabilized. These off-stoichiometric phases hinder hole transport and reduce hole mobility due to the presence of high-density neutral copper vacancies.
Copper iodide (CuI) has gained attention as a highly conductive p-type transparent material. Here, we investigate the phase stability of I-rich cubic CuI phases with Cu-vacancy defects by performing hybrid-density functional theory calculations. In the Cu-rich equilibrium condition, the nearly stoichiometric phase is the ground state with quenched Cu-vacancy defects, and the Cu-vacancy defect is a major acceptor responsible for the intrinsic p-type conductivity. In contrast, in the I-rich condition, the off-stoichiometric Cu1-xIx phase (x = 0.5-0.55) containing high-density Cu vacancies is stabilized with configuration entropy from Cu vacancies. As the off-stoichiometric phases contain high-density neutral Cu vacancies, the hole transport can be hindered, and the hole mobility could be reduced. (c) 2021 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).

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