Related references
Note: Only part of the references are listed.Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges
Ming-Yi Tsai et al.
MATERIALS (2021)
Warpage Characterization of Molded Wafer for Fan-Out Wafer-Level Packaging
Hsien-Chie Cheng et al.
JOURNAL OF ELECTRONIC PACKAGING (2020)
Simulation of Wire Bonding Process Using Explicit Fem with Ale Remeshing Technology
C. C. Yang et al.
JOURNAL OF MECHANICS (2020)
Viscoelastic Warpage Modeling of Fan-Out Wafer-Level Packaging During Wafer-Level Mold Cure Process
Hsien-Chie Cheng et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2020)
A New Viscoelasticity Dynamic Fitting Method Applied for Polymeric and Polymer-Based Composite Materials
Vitor Dacol et al.
MATERIALS (2020)
Modelling of Effective Thermal Conductivity of Composites Filled with Core-Shell Fillers
Jan Czyzewski et al.
MATERIALS (2020)
Thermal and Electrical Characterization of Power Mosfet Module Using Coupled Field Analysis
H-C Cheng et al.
JOURNAL OF MECHANICS (2019)
Reliability Assessment of Wafer Level Package using Artificial Neural Network Regression Model
P. H. Chou et al.
JOURNAL OF MECHANICS (2019)
Long-term viscoelastic properties of an adhesive and molding compound, characterization and modeling
Mohammad Rezai Sangtabi et al.
POLYMER (2017)
An embedded trace FCCSP substrate without glass cloth
Shin-Hua Chao et al.
MICROELECTRONICS RELIABILITY (2016)
THE SEMICONDUCTOR INDUSTRY WILL SOON ABANDON ITS PURSUIT OF MOORE'S LAW. NOW THINGS COULD GET A LOT MORE INTERESTING
M. Mitchell Waldrop
NATURE (2016)
Macroscopic Mechanical Constitutive Characterization of Through-Silicon-via-Based 3-D Integration
Hsien-Chie Cheng et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2016)
Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound
M. Sadeghinia et al.
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES (2012)
Characterization of the viscoelastic properties of an epoxy molding compound during cure
M. Sadeghinia et al.
MICROELECTRONICS RELIABILITY (2012)