Anodic Electrodeposition of Chitosan-AgNP Composites Using In Situ Coordination with Copper Ions

Chitosan is an attractive material for biomedical applications. A novel approach for the anodic electrodeposition of chitosan-AgNP composites using in situ coordination with copper ions is proposed in this work. The surface and cross-section morphology of the obtained coating with varying concentrations of AgNPs were evaluated by SEM, and surface functional groups were analyzed with FT-IR spectroscopy. The mechanism of the formation of the coating based on the chelation of Cu(II) ions with chitosan was discussed. The antibacterial activity of the coatings towards Staphylococcus epidermidis ATCC 35984/RP62A bacteria was analyzed using the live-dead approach. The presented results indicate that the obtained chitosan-AgNP-based films possess some limited anti-biofilm-forming properties and exhibit moderate antibacterial efficiency at high AgNP loads.

Automated summary

An innovative method using copper ions for the anodic electrodeposition of chitosan-AgNP composites was proposed in this study, which showed limited anti-biofilm-forming properties and moderate antibacterial efficiency at high AgNP loads. The results indicate the potential of these films for biomedical applications.