Identifying the elastoplastic properties of ductile film on hard substrate by nanoindentation

Nanoindentation analysis was proposed on a ductile film/hard substrate system to extract the elastoplastic properties of thin film. Based on the dimensional analysis method (DAM), relationships between the indentation responses and film/substrate elastoplastic properties were established. Reverse analysis algorithms were proposed by introducing the substrate effects, which could provide sufficient information at different indentation depths to solve the dimensional equations. Numerical and instrumental indentations were carried out on a titanium film/alumina ceramic substrate system to verify the proposed reverse method, by which the elastic modulus, yield stress and work hardening exponent of the film were successfully obtained.

Automated summary

Nanoindentation analysis was used to extract the elastoplastic properties of thin films on hard substrates. The relationships between indentation responses and film/substrate properties were established through dimensional analysis method. Reverse analysis algorithms were proposed to introduce substrate effects and provide information at different indentation depths, successfully obtaining elastic modulus, yield stress, and work hardening exponent of the film.