Journal
SURFACE & COATINGS TECHNOLOGY
Volume 422, Issue -, Pages -Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.surfcoat.2021.127501
Keywords
Magnetron discharge; Low pressure; WSi2-films; Sputtering; Deposition; Plasma
Funding
- Russian Foundation for Basic Research [19-48-700003, FWRM-2021-0006]
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The study focused on tungsten disilicide film deposition using planar magnetron sputtering at low operating gas pressure. Factors such as substrate temperature, distance from the magnetron, ion current density distribution, and operating pressure were investigated for their effects on film properties.
We describe our work on tungsten disilicide film deposition by planar magnetron sputtering at low operating gas pressure (down to 0.08 Pa). The sputter target was a tungsten disilicide composite with diameter 125 mm, and the DC magnetron current 0.1-1 A. We have explored the dependence of film homogeneity over the 100 mm diameter substrate on substrate temperature and distance from the magnetron, and the spatial distribution of ion current density and the effect of operating pressure on the roughness and resistivity of the films.
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