4.7 Article

Enhancing strength-ductility synergy in a casting non-equiatomic NiCoCr-based high-entropy alloy by Al and Ti combination addition

Journal

SCRIPTA MATERIALIA
Volume 200, Issue -, Pages -

Publisher

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2021.113898

Keywords

High-entropy alloy; Nanoprecipitate; Cast; Mechanical properties; Precipitation strengthening

Funding

  1. National Key RAMP
  2. D Program of China [2017YFE0301505]
  3. National Natural Science Foundation of China [51871245]
  4. Natural Science Foundation of Hunan Province [2018JJ2504]
  5. State Key Laboratory for Powder Metallurgy
  6. Science and Technology on High Strength Structural Materials Laboratory, Central South University

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By doping Al and Ti, the high-entropy alloy exhibits enhanced strength-ductility synergy with uniformly distributed, high-content nanoprecipitates. The formation of various dislocation substructures and crossed stacking faults contributes to the strain hardening of the high-entropy alloy.
A non equiatomic Ni3.5Co3Cr1.5 medium-entropy alloy (AT0) with a single-phase face-centered cubic structure (FCC) directly obtained by arc-melting shows the low yield strength of 147 MPa, ultimate tensile strength of 447 MPa and large total elongation to fracture of 78.8%. By doping Al and Ti, the as-cast (Ni3.5Co3Cr1.5)(90)Al5Ti5 high-entropy alloy (AT5) exhibits enhanced strength-ductility synergy. Compared to AT0 alloy, the yield strength of AT5 alloy increases more than fivefold to 792 MPa, ultimate tensile strength doubles to 1004 MPa, and still remaining a high elongation of 38.2%. The apparent increase in strength can be attributed to uniformly distributed, high-content, conherent (Ni,Co)(3)(Al,Ti)-type nanoprecipitates formed in FCC matrix. The formation of various dislocation substructures and crossed stacking faults (SFs) with Lomer-Cottrell locks during tensile deformation is responsible for strain hardening of AT5 alloy. (C) 2021 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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