4.7 Article

The synthesis of TiC dispersed strengthened Mo alloy by freeze-drying technology and subsequent low temperature sintering

Journal

SCRIPTA MATERIALIA
Volume 198, Issue -, Pages -

Publisher

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2021.113831

Keywords

Mo-TiC; Freeze-drying; Low temperature sintering; Ultrafine grains

Funding

  1. Natural Science Foundation of Tianjin [18JCYBJC17900]
  2. National Natural Science Foundation of China [51822404]
  3. Science and Technology Program of Tianjin [19YFZCGX00790, 18YFZCGX00070]
  4. King Saud University, Riyadh, Saudi Arabia [RSP-2021/6]

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The TiC dispersed strengthened Mo alloys were synthesized using novel freeze-drying technology, resulting in ultrafine grain size, high density, and high hardness. The freeze-drying technology effectively suppressed the agglomeration and growth of second phase particles in Mo-TiC alloys. A theory about purification and strengthening was proposed, where TiC can purify the Mo matrix and form stable phase interfaces with Mo to enhance material strength.
The TiC dispersed strengthened Mo alloys were synthesized by novel freeze-drying technology and subsequent low-temperature sintering. With the introduction of TiC nanoparticles using freeze-drying technology, the sintered Mo-TiC alloys possess ultrafine grain size (2.38 mu m), high density (99.3%) and high hardness (402 +/- 29 HV0.2). The agglomeration and growth of second phase particles in Mo-TiC alloys were effectively depressed by freeze-drying technology. Moreover, a theory about purification and strengthening is proposed. C-deficient TiC (Ti8C5) will adsorb nearby oxygen impurities and even form TiO2 to purify Mo matrix. Furthermore, TiC (002), Ti8C5 (0-24) and TiO2 (111) can form coherent interfaces with Mo (110) to strengthen their phase boundary and improve material strength. The stable phase interface can pin and limit the growth of these second phase particles, thus maintaining their small size (<50 nm). (C) 2021 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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