4.5 Article

Thermal conductivity measurements of sub-surface buried substrates by steady-state thermoreflectance

Journal

REVIEW OF SCIENTIFIC INSTRUMENTS
Volume 92, Issue 6, Pages -

Publisher

AMER INST PHYSICS
DOI: 10.1063/5.0049531

Keywords

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Funding

  1. U.S. Office of Naval Research under a MURI program [N00014-18-1-2429]
  2. Deanship of Scientific Research at the King Fahd University of Petroleum and Minerals [DF191001]
  3. Office of Naval Research

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This study investigates the thermal conductivity of buried substrates using the optical pump-probe technique SSTR, providing guidance for future measurements. The steady-state nature of SSTR allows it to measure the thermal properties of buried substrates that are traditionally challenging to measure with transient pump-probe techniques.
Measuring the thermal conductivity of sub-surface buried substrates is of significant practical interests. However, this remains challenging with traditional pump-probe spectroscopies due to their limited thermal penetration depths. Here, we experimentally and numerically investigate the TPD of the recently developed optical pump-probe technique steady-state thermoreflectance (SSTR) and explore its capability for measuring the thermal properties of buried substrates. The conventional definition of the TPD (i.e., the depth at which temperature drops to 1/e value of the maximum surface temperature) does not truly represent the upper limit of how far beneath the surface SSTR can probe. For estimating the uncertainty of SSTR measurements of a buried substrate a priori, sensitivity calculations provide the best means. Thus, detailed sensitivity calculations are provided to guide future measurements. Due to the steady-state nature of SSTR, it can measure the thermal conductivity of buried substrates that are traditionally challenging by transient pump-probe techniques, exemplified by measuring three control samples. We also discuss the required criteria for SSTR to isolate the thermal properties of a buried film. Our study establishes SSTR as a suitable technique for thermal characterizations of sub-surface buried substrates in typical device geometries.

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