Journal
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
Volume 71, Issue -, Pages 119-129Publisher
ELSEVIER SCIENCE INC
DOI: 10.1016/j.precisioneng.2021.03.005
Keywords
Inconel 718; Polishing; Electrochemical etching; Roughness; Etching anisotropy
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Funding
- National Natural Science Foundation of China [52035009, 52005243]
- research fund for International Cooperation from the Science and Technology Innovation Committee of Shenzhen Municipality, Shenzhen, China [GJHZ20180928155412525]
- Shenzhen High-level Innovation and Entrepreneurship Fund from the Science and Technology Innovation Committee of Shenzhen Municipality, Shenzhen, China [KQTD20170810110250357]
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Research on the isotropic etching polishing of nickel-based superalloy Inconel 718 (IN718) found that by adjusting the electrolyte concentration and maintaining temperature, the etching anisotropy can be transformed into isotropic etching, and polishing at higher currents facilitates rapid polishing.
For the highly efficient and versatile polishing of metals, isotropic etching polishing (IEP), which is based on the merging of isotropic etching holes, has been developed. In this study, the feasibility and mechanism of isotropic etching polishing of nickel-based superalloy Inconel 718 (IN718) and the polishing characteristics have been studied. The potentiodynamic experiments revealed similar trends of the cathodic, passive, second passivation, and transpassive regions in all the electrolytes, while the corrosion susceptibility of IN718 successively decreased with the increasing H2SO4 concentration in the electrolyte. The etching anisotropy of the IN718 precipitated with different phases can be experimentally transmuted to isotropic etching by modulating the electrolyte concentration and keeping electrolyte temperature equal or above the room temperature. Because of the positive correlation of the etching current with isotropic holes density and diameter, etching at higher currents is promoted for the rapid and proficient polishing. The surface evolution mechanism during IEP has been confirmed. The surface roughness initially increased due to the formation of etching holes, then decreased abruptly owing to the rapid merging of etching holes and finally achieved a smooth surface. The wet grounded surface of IN718 with a roughness of Sa 62.7 nm has been transformed into a mirror-like smooth surface with a roughness of Sa 0.86 nm within 300 s of IEP at optimized conditions and a high MRR of 2.73 mm3/min has been achieved.
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