4.5 Article

Effect of substrate temperature on the crystalline phases of Cu2-xTe films grown by RF sputtering

Journal

PHYSICA B-CONDENSED MATTER
Volume 624, Issue -, Pages -

Publisher

ELSEVIER
DOI: 10.1016/j.physb.2021.413372

Keywords

Copper telluride; Cu2-xTe; RF magnetron Sputtering; Commensurately modulated lattices; Crystalline structure

Funding

  1. Consejo Nacional de Ciencia y Tecnologia (CONACyT) of Mexico [J-83247-, 169702]

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The study investigated how the substrate temperature affects the growth of Cu2-xTe films using the RF sputtering technique, discovering different structural phases at various temperatures. A new stoichiometric Cu7Te4 phase, delta', was identified at all temperatures, while higher temperatures favored the delta' phase with Cu7Te4 or Cu2-xTe composition and lower temperatures favored the commensurate superstructure 7C with higher Cu/Te ratio. The transition between these phases was observed at around 250 degrees C.
The effect of the substrate temperature (Ts) on the growth of Cu2-xTe films using the RF sputtering technique has been studied through a structural assessment of the different trigonal (space group P3m1) phases encountered in the range 100-350 degrees C. A new stoichiometric Cu7Te4 phase (delta') with Z = 1 is proposed, and it is present in all the temperatures studied. Low-angle peaks (2 theta < 20 degrees) of Glancing Incidence X-ray Diffraction (GIXD) patterns are consistent with the formation of commensurate phases (forms alpha') through variations in the c parameter whose value can be as large as 25.47 angstrom. The base modulation vector is the c parameter of the unit-cell of phase delta' that, in this work, resulted in a value of 3.61 angstrom. The origin of the observed commensurate phases has been ascribed to an occupancy-wave modulation. Whereas at high temperatures (Ts > 250 degrees C), the major phase is delta' (Cu7Te4 or Cu2-xTe with x = 0.25), the predominant phase, for Ts < 250 degrees C, is the commensurate superstructure 7C with higher [Cu]/[Te] ratio (x < 0.25). The transition between these two thermal regimes is stated at a temperature of about 250 degrees C. Maintaining a constant global composition, the devaluation of [Cu] in films, with the temperature above the transition range, is explained in terms of diffusion of copper downward the film and towards its edges.

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