A Roadmap for Disruptive Applications and Heterogeneous Integration Using Two-Dimensional Materials: State-of-the-Art and Technological Challenges

This Mini Review attempts to establish a roadmap for two-dimensional (2D) material-based microelectronic technologies for future/disruptive applications with a vision for the semiconductor industry to enable a universal technology platform for heterogeneous integration. The heterogeneous integration would involve integrating orthogonal capabilities, such as different forms of computing (classical, neuromorphic, and quantum), all forms of sensing, digital and analog memories, energy harvesting, and so forth, all in a single chip using a universal technology platform. We have reviewed the state-of-the-art 2D materials such as graphene, transition metal dichalcogenides, phosphorene and hexagonal boron nitride, and so forth, and how they offer unique possibilities for a range of futuristic/disruptive applications. Besides, we have discussed the technological and fundamental challenges in enabling such a universal technology platform, where the world stands today, and what gaps are required to be filled.

Automated summary

This Mini Review aims to establish a roadmap for 2D material-based microelectronic technologies for future/disruptive applications in the semiconductor industry, enabling heterogeneous integration on a universal technology platform. The review examines state-of-the-art 2D materials such as graphene, transition metal dichalcogenides, phosphorene, hexagonal boron nitride, among others, and their potential for a range of futuristic applications. Additionally, it discusses the technological and fundamental challenges in enabling a universal technology platform and identifies the current gaps that need to be addressed.