4.2 Article

Experimental investigation and process optimization of the ultrasonic welding applied to papersExperimentelle Untersuchung und Prozessoptimierung von Ultraschallschweissen von Papier

Journal

MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK
Volume 52, Issue 8, Pages 891-906

Publisher

WILEY-V C H VERLAG GMBH
DOI: 10.1002/mawe.202100031

Keywords

Ultrasonic welding; paper; paperboard; process optimization; experimentation; instrumentation

Funding

  1. French ANR (Agence National de la Recherche)

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This study investigated the ultrasonic welding process applied to papers, revealing the high sensitivity of the process to parameters such as vibration amplitude, power, and sample thickness. A significant decrease in the strength of welded joints was observed when working with low thicknesses.
Ultrasonic welding is a serious candidate in the development of methods to assemble papers and paperboards without using additional substances. However, the ultrasonic welding of papers remains a technological challenge considering the low weldability of lignocellulosic materials. This study aims to investigate on the ultrasonic welding process applied to papers in order to identify the processing conditions which favor the formation of strong welded joints. To reach such purpose, an experimental strategy was developed by combining the characterization of welded materials and the monitoring of process parameters. Experimentations were performed using a reference paper displaying a good weldability to specifically highlight the contribution of process parameters. Results indicate that the process is highly sensitive to vibration amplitude, power supplied by the high frequency generator, and sample thickness. Power seems to be a reliable indicator of the severity of the process. A strong decrease in the strength of the welded joints is observed when working with low thicknesses. It seems that the layers coated on top of papers are the main part of the material contributing in the development of adhesion at the welding joint. Overall, instrumenting the device has led to a better understanding of the ultrasonic welding of papers.

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