Related references
Note: Only part of the references are listed.Microscopic contact pressure and material removal modeling in rail grinding using abrasive belt
Wengang Fan et al.
PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE (2021)
Characteristic assessment and analysis of residual stresses generated by dry belt finishing on hard turned AISI52100
Wenxi Wang et al.
JOURNAL OF MANUFACTURING PROCESSES (2020)
Sawing stress of SiC single crystal with void defect in diamond wire saw slicing
Yufei Gao et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2019)
The effect of cut depth and distribution for abrasives on wafer surface morphology in diamond wire sawing of PV polycrystalline silicon
Xinying Li et al.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2019)
Wire Vibration Modeling and Experimental Analysis for Wire Saw Machining
Aofei Tang et al.
JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME (2019)
Evaluation of fixed abrasive diamond wire sawing induced subsurface damage of solar silicon wafers
Huapan Xiao et al.
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2019)
Coupling stress caused by thermal and slicing force in KDP crystal slicing with fixed abrasive wire saw
Zongqiang Li et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2018)
A review on ductile mode cutting of brittle materials
Elijah Kwabena Antwi et al.
FRONTIERS OF MECHANICAL ENGINEERING (2018)
Finite element analysis of multi-wire saw silicon rods with consolidated abrasive diamonds
Chaohua Wu et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2017)
Depth of cut per abrasive in fixed diamond wire sawing
Chunhui Chung et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2015)
Generation of diamond wire sliced wafer surface based on the distribution of diamond grits
Chunhui Chung et al.
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING (2014)
Machining processes for sapphire wafers: a literature review
Z. C. Li et al.
PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE (2011)
Basic mechanisms and models of multi-wire sawing
HJ Möller
ADVANCED ENGINEERING MATERIALS (2004)
On the mechanics of the grinding process - Part I. Stochastic nature of the grinding process
ZB Hou et al.
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE (2003)