Related references
Note: Only part of the references are listed.Study on process parameters of fabrication fine diameter electroplated diamond wire for slicing crystalline silicon solar cell
Hongshuang Li et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2020)
Experimental study on slicing photovoltaic polycrystalline silicon with diamond wire saw
Youkang Yin et al.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2020)
Meso-scale tool breakage prediction based on finite element stress analysis for shoulder milling of hardened steel
Yifan Gao et al.
JOURNAL OF MANUFACTURING PROCESSES (2020)
Analytical prediction of subsurface microcrack damage depth in diamond wire sawing silicon crystal
Liyuan Wang et al.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2020)
A new method of determining the slicing parameters for fixed diamond wire saw
Tengyun Liu et al.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2020)
Research on the machinability of A-plane sapphire under diamond wire sawing in different sawing directions
Ningchang Wang et al.
CERAMICS INTERNATIONAL (2019)
Finite element simulation study on pre-stress multi-step cutting of Ti-6Al-4V titanium alloy
Xuhao Song et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2019)
Material removal and surface generation mechanisms in diamond wire sawing of silicon crystal
Yufei Gao et al.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2019)
Study on mechanism of crack propagation of sapphire single crystals of four different orientations under impact load and static load
Ke Wang et al.
CERAMICS INTERNATIONAL (2019)
Nucleation location and propagation direction of radial and median cracks for brittle material in scratching
Xinying Li et al.
CERAMICS INTERNATIONAL (2019)
Coupling stress caused by thermal and slicing force in KDP crystal slicing with fixed abrasive wire saw
Zongqiang Li et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2018)
Study on the subsurface microcrack damage depth in electroplated diamond wire saw slicing SiC crystal
Yufei Gao et al.
CERAMICS INTERNATIONAL (2018)
Finite element analysis of multi-wire saw silicon rods with consolidated abrasive diamonds
Chaohua Wu et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2017)
A finite element analysis of sawing stress in fixed-abrasive wire saw slicing KDP crystal
Mengran Ge et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2017)
Depth of cut for single abrasive and cutting force in resin bonded diamond wire sawing
Tengyun Liu et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2017)
Analytical Force Modeling of Fixed Abrasive Diamond Wire Saw Machining With Application to SiC Monocrystal Wafer Processing
Shujuan Li et al.
JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME (2017)
Prediction of sawing force for single-crystal silicon carbide with fixed abrasive diamond wire saw
Peizhi Wang et al.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2017)
Mechanisms of material removal and subsurface damage in fixed-abrasive diamond wire slicing of single-crystalline silicon
Takaaki Suzuki et al.
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY (2017)
Surface characteristics and damage distributions of diamond wire sawn wafers for silicon solar cells
Bhushan Sopori et al.
AIMS MATERIALS SCIENCE (2016)
Finite element investigation on the evolution of wear and stresses in brazed CBN grits during grinding
Wen-Feng Ding et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2015)
Heat Transfer During Multiwire Sawing of Silicon Wafers
Lars Johnsen et al.
Journal of Thermal Science and Engineering Applications (2012)
Roughness Damage Evolution Due to Wire Saw Process
Egemen Teomete
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING (2011)
A finite element analysis of temperature variation in silicon wafers during wiresaw slicing
Sumeet Bhagavat et al.
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE (2008)
Durability studies of micro/nanoelectromechanical systems materials, coatings and lubricants at high sliding velocities (up to 10 mm/s) using a modified atomic force microscope
NS Tambe et al.
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A (2005)
Three-dimensional shape modeling of diamond abrasive grains measured by a scanning laser microscope
T Mahmoud et al.
ADVANCES IN ABRASIVE TECHNOLOGY V (2003)
General trends about photovoltaics based on crystalline silicon
TM Bruton
SOLAR ENERGY MATERIALS AND SOLAR CELLS (2002)
Temperature distributions and thermal deformations of mirror substrates in laser resonators
YF Peng et al.
APPLIED OPTICS (2001)