Journal
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume 823, Issue -, Pages -Publisher
ELSEVIER SCIENCE SA
DOI: 10.1016/j.msea.2021.141729
Keywords
Sintered Ag; Mode II fracture Toughness; ENF test; Sintering parameter; Microstructure
Categories
Funding
- Beijing Municipal Natural Science Foundation [2204074]
- National Natural Science Foundation of China [11902009]
- Scientific Research Common Program of Beijing Municipal Commission of Education [KM202010005034]
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This paper investigates the mode II fracture toughness of sintered silver (Ag) and shows that the fracture toughness increases rapidly with the increase of sintering temperature and holding time. Three different shearing crack types are confirmed. Statistical analysis on microstructure evolution reveals that the shearing fracture toughness is influenced by Ag particle size, particle shape form factor, and porosity.
Shearing fracture toughness of sintered silver (Ag) is an important parameter to reflect its shearing resistance. In this paper, mode II fracture toughness of sintered Ag is investigated based on end-notched flexure (ENF) test. Various sintering conditions are adopted to study the effect of sintering parameters on mode II fracture toughness of sintered Ag. The results show that the fracture toughness of sintered Ag increases rapidly with the increase of sintering temperature and holding time. Three shearing crack types are confirmed, i.e., interface delamination, tunneling cracking and cohesive cracking, and the cracking type varies from interface delamination or tunneling cracking to cohesive cracking with the increase of sintering temperature and holding time. An empirical equation is proposed to predict the mode II fracture toughness of sintered Ag. Through statistics investigation on microstructure evolution, it is found that the shearing fracture toughness heightens with enlargement of the Ag particle size, increase of the particle shape form factor, and decrease of the porosity. This study provides an alternative method to rigorously evaluate the shearing fracture toughness of die-attach materials in electronics packaging.
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