Related references
Note: Only part of the references are listed.Stealth dicing of sapphire sheets with low surface roughness, zero kerf width, debris/crack-free and zero taper using a femtosecond Bessel beam
Zhaoqing Li et al.
OPTICS AND LASER TECHNOLOGY (2021)
PICOSECOND LASER MICROMACHINING OF SILICON WAFER: CHARACTERIZATIONS AND ELECTRICAL PROPERTIES
Fang Zhihao et al.
SURFACE REVIEW AND LETTERS (2020)
Target properties - Plasma dynamics relationship in laser ablation of metals: Common trends for fs, ps and ns irradiation regimes
Stefan Andrei Irimiciuc et al.
APPLIED SURFACE SCIENCE (2020)
Study on process parameters of fabrication fine diameter electroplated diamond wire for slicing crystalline silicon solar cell
Hongshuang Li et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2020)
Experimental study on slicing photovoltaic polycrystalline silicon with diamond wire saw
Youkang Yin et al.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2020)
Laser ablation of silicon in water at different temperatures
Wisan Charee et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2020)
One-Step Femtosecond Laser Stealth Dicing of Quartz
Caterina Gaudiuso et al.
MICROMACHINES (2020)
Pulse-duration dependence of laser-induced modifications inside silicon
Amlan Das et al.
OPTICS EXPRESS (2020)
Sub-Picosecond Micromachining of Monocrystalline Silicon for Solar Cell Manufacturing
Katarzyna Garasz et al.
APPLIED SCIENCES-BASEL (2020)
Damage-Less Singulation of Ultra-Thin Wafers using Stealth Dicing
Natsuki Suzuki et al.
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020) (2020)
Effect of fs/ps laser pulsewidth on ablation of metals and silicon in air and liquids, and on their nanoparticle yields
I. N. Saraeva et al.
APPLIED SURFACE SCIENCE (2019)
Microcrystalline silicon thin film deposition from silicon tetrafluoride: Isolating role of ion energy using tailored voltage waveform plasmas
Junkang Wang et al.
SOLAR ENERGY MATERIALS AND SOLAR CELLS (2019)
Characterization and control of laser induced modification inside silicon
Xinya Wang et al.
JOURNAL OF LASER APPLICATIONS (2019)
Analysis of nanosecond and femtosecond laser ablation of rear dielectrics of silicon wafer solar cells
Jaffar Moideen Yacob Ali et al.
SOLAR ENERGY MATERIALS AND SOLAR CELLS (2019)
The unbiased propagation mechanism in laser cutting silicon wafer with laser induced thermal-crack propagation
Xiaoliang Cheng et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2019)
Numerical study on thermal stress cutting of silicon wafers using two-line laser beams
Sungho Choi et al.
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY (2019)
Temperature field modeling and cut formation in laser micromachining of silicon in ice layer
Viboon Tangwarodomnukun et al.
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2019)
Studies on laser ablation of silicon using near IR picosecond and deep UV nanosecond lasers
M. E. Shaheen et al.
OPTICS AND LASERS IN ENGINEERING (2019)
Laser ablation mechanism of silicon nitride with nanosecond and picosecond lasers
B. Soltani et al.
OPTICS AND LASER TECHNOLOGY (2019)
Effect of scanning pitch on nanosecond laser micro-drilling of silicon nitride ceramic
Hong-Jian Wang et al.
CERAMICS INTERNATIONAL (2018)
Characterization of hole taper in laser drilling of silicon nitride ceramic under water
Qiang Chen et al.
CERAMICS INTERNATIONAL (2018)
A hybrid method of ultrafast laser dicing and high density plasma etching with water soluble mask for thin silicon wafer cutting
Shih-jeh Wu
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2018)
Experimental analysis of Nd-YAG laser cutting of sheet materials - A review
Amit Sharma et al.
OPTICS AND LASER TECHNOLOGY (2018)
Controllable laser thermal cleavage of sapphire wafers
Jiayu Xu et al.
OPTICS AND LASERS IN ENGINEERING (2018)
A novel technique for slicing SiC ingots by EDM utilizing a running ultra-thin foil tool electrode
Yonghua Zhao et al.
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY (2018)
Femtosecond laser ablation of dielectric layers for high-efficiency silicon wafer solar cells
Jaffar Moideen Yacob Ali et al.
SOLAR ENERGY (2018)
Rational design of silicon structures for optically controlled multiscale biointerfaces
Yuanwen Jiang et al.
NATURE BIOMEDICAL ENGINEERING (2018)
Integrating photonics with silicon nanoelectronics for the next generation of systems on a chip
Amir H. Atabaki et al.
NATURE (2018)
Wavelength scaling of silicon laser ablation in picosecond regime
A. Sikora et al.
JOURNAL OF APPLIED PHYSICS (2017)
Nanosecond-laser patterning of 3Y-TZP: Damage and microstructural changes
E. Roitero et al.
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY (2017)
Laser drilling of structural ceramics-A review
Hongjian Wang et al.
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY (2017)
Laser cutting sandwich structure glass-silicon-glass wafer with laser induced thermal-crack propagation
Yecheng Cai et al.
OPTICS AND LASER TECHNOLOGY (2017)
Silicon crystallinity control during laser direct microstructuring with bursts of picosecond pulses
Jaka Mur et al.
OPTICS EXPRESS (2017)
Enhancement of surface area and wettability properties of boron doped diamond by femtosecond laser-induced periodic surface structuring
Eduardo Granados et al.
OPTICAL MATERIALS EXPRESS (2017)
Ultrafast-laser dicing of thin silicon wafers: strategies to improve front- and backside breaking strength
Matthias Domke et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2017)
Stealth dicing of sapphire wafers with near infra-red femtosecond pulses
Amit Yadav et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2017)
Comparison of bending fracture strength of silicon after ablation with nanosecond and picosecond lasers
Jiwhan Noh et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2016)
Threshold for permanent refractive index change in crystalline silicon by femtosecond laser irradiation
D. Bachman et al.
APPLIED PHYSICS LETTERS (2016)
Liquid-assisted laser ablation of advanced ceramics and glass-ceramic materials
A. Garcia-Giron et al.
APPLIED SURFACE SCIENCE (2016)
A study on co-axial water-jet assisted fiber laser grooving of silicon
Yuvraj K. Madhukar et al.
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2016)
Ultrashort pulse laser dicing of thin Si wafers: the influence of laser-induced periodic surface structures on the backside breaking strength
Matthias Domke et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2016)
Industrial applications of ultrafast laser processing
Eric Mottay et al.
MRS BULLETIN (2016)
Laser cutting silicon-glass double layer wafer with laser induced thermal-crack propagation
Yecheng Cai et al.
OPTICS AND LASERS IN ENGINEERING (2016)
Beam delivery system with a non-digitized diffractive beam splitter for laser-drilling of silicon
J. Amako et al.
OPTICS AND LASERS IN ENGINEERING (2016)
Laser ablation of titanium nitride coated on silicon wafer substrate for depth profiling using ICP-MS
Jin Sook Lee et al.
APPLIED SURFACE SCIENCE (2015)
Multi-Strata Stealth Dicing Before Grinding for Singulation-Defects Elimination and Die Strength Enhancement: Experiment and Simulation
Weng Hong Teh et al.
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING (2015)
Dicing of Thin Silicon Wafers with Ultra-Short Pulsed Lasers in the Range from 200 fs up to 10 ps
C. Fornaroli et al.
JOURNAL OF LASER MICRO NANOENGINEERING (2015)
Optimization of plasma effect in laser drilling of high aspect ratio microvias
V. N. Tokarev et al.
LASER PHYSICS (2015)
Theoretical study of pre-formed hole geometries on femtosecond pulse energy distribution in laser drilling
L. S. Jiao et al.
OPTICS EXPRESS (2015)
Multi-discharge EDM coring of single crystal SiC ingot by electrostatic induction feeding method
Yonghua Zhao et al.
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY (2015)
Laser Micromachining of Glass, Silicon, and Ceramics
L. Rihakova et al.
ADVANCES IN MATERIALS SCIENCE AND ENGINEERING (2015)
Ultrafast laser processing of materials: a review
Katherine C. Phillips et al.
ADVANCES IN OPTICS AND PHOTONICS (2015)
Laser ablation of silicon in water under different flow rates
Wisan Charee et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2015)
Low-cost silicon wafer dicing using a craft cutter
Yiqiang Fan et al.
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS (2015)
Micro-drilling of silicon wafer by industrial CO2 laser
Sivaraos Subramonian et al.
INTERNATIONAL JOURNAL OF MECHANICAL AND MATERIALS ENGINEERING (2015)
A unified model to determine the energy partitioning between target and plasma in nanosecond laser ablation of silicon
G. Galasso et al.
JOURNAL OF APPLIED PHYSICS (2015)
Influence of substrate heating on hole geometry and spatter area in femtosecond laser drilling of silicon
L. S. Jiao et al.
APPLIED PHYSICS LETTERS (2014)
Laser Cold Ablation as a Cutting Edge Method of Forming Silicon Wafers Used in Solar Cells
Piotr Sek et al.
TEROTECHNOLOGY (2014)
Microhole machining of silicon wafer in air and under deionized water by pulsed UV laser system
Wen-Tse Hsiao et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2013)
Detection of buried layers in silicon devices using LIBS during hole drilling with femtosecond laser pulses
S. P. Banerjee et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2013)
Influence of ambient pressure on the hole formation in laser deep drilling
S. Doering et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2013)
Improving the dielectric breakdown field of silicon light-emitting-diode sub-mount by a hybrid nanosecond laser drilling strategy
Chao-Wei Tang et al.
MICROELECTRONICS RELIABILITY (2013)
Femtosecond versus picosecond laser machining of nano-gratings and micro-channels in silica glass
Costantino Corbari et al.
OPTICS EXPRESS (2013)
Fundamental study on multi-wire EDM slicing of SiC by wire electrode with track-shaped section
A. Kimura et al.
PROCEEDINGS OF THE SEVENTEENTH CIRP CONFERENCE ON ELECTRO PHYSICAL AND CHEMICAL MACHINING (ISEM) (2013)
Experimental study of diode laser cutting of silicon by means of water assisted thermally driven separation mechanism
P. Romero et al.
LASERS IN MANUFACTURING (LIM 2013) (2013)
Advantages of picosecond laser machining for cutting-edge technologies
C. Moorhouse
LASERS IN MANUFACTURING (LIM 2013) (2013)
Dicing of thin Si wafers with a picosecond laser ablation process
C. Fornaroli et al.
LASERS IN MANUFACTURING (LIM 2013) (2013)
Femtosecond laser drilling of crystalline and multicrystalline silicon for advanced solar cell fabrication
Sanghoon Ahn et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2012)
Infrared long nanosecond laser pulse ablation of silicon: Integrated two-dimensional modeling and time-resolved experimental study
Sha Tao et al.
APPLIED SURFACE SCIENCE (2012)
A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries
Muhammad Arif et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2012)
An investigation of hybrid laser-waterjet ablation of silicon substrates
V. Tangwarodomnukun et al.
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE (2012)
Improving the sidewall quality of nanosecond laser-drilled deep through-silicon vias by incorporating a wet chemical etching process
Chao-Wei Tang et al.
MICRO & NANO LETTERS (2012)
Light extraction efficiency improvement by multiple laser stealth dicing in InGaN-based blue light-emitting diodes
Yiyun Zhang et al.
OPTICS EXPRESS (2012)
Laser cutting of silicon with the liquid jet guided laser using a chlorine-containing jet media
Sybille Hopman et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2011)
Role of volatile liquids in debris and hole taper angle reduction during femtosecond laser drilling of silicon
L. S. Jiao et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2011)
Physical mechanism of silicon ablation with long nanosecond laser pulses at 1064 nm through time-resolved observation
Yun Zhou et al.
APPLIED SURFACE SCIENCE (2011)
Water Jet Guided Laser Cutting of Silicon Thin Films Using 515nm Disk Laser
Eva-Maria Heilmann et al.
JOURNAL OF LASER MICRO NANOENGINEERING (2011)
Micro-machining of silicon wafer in air and under water
L. M. Wee et al.
OPTICS AND LASER TECHNOLOGY (2011)
STATISTICAL ANALYSIS OF FEMTOSECOND PULSES LASER ON HOLE DRILLING OF SILICON WAFER
L. Jiao et al.
SURFACE REVIEW AND LETTERS (2011)
Experimental study of infrared nanosecond laser ablation of silicon: The multi-pulse enhancement effect
Ziyi Fu et al.
APPLIED SURFACE SCIENCE (2010)
Analysis of Silicon via Hole Drilling for Wafer Level Chip Stacking by UV Laser
Young-Hyun Lee et al.
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING (2010)
Very large spot size effect in nanosecond laser drilling efficiency of silicon
F. Brandi et al.
OPTICS EXPRESS (2010)
Theoretical approach to estimate laser process parameters for drilling in crystalline silicon
T. Baier et al.
PROGRESS IN PHOTOVOLTAICS (2010)
High repetition rate femtosecond laser nano-machining of thin films
B. Tan et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2009)
Comparison of Laser Chemical Processing and LaserMicroJet for structuring and cutting silicon substrates
Sybille Hopman et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2009)
UV excimer laser drilled high aspect ratio submicron via hole
K. H. Chen et al.
APPLIED SURFACE SCIENCE (2009)
Thermal modeling and experimental study of infrared nanosecond laser ablation of silicon
Sha Tao et al.
JOURNAL OF APPLIED PHYSICS (2009)
Potential and limits of chemical enhanced deep cutting of silicon with a coupled laser-liquid jet
A. Fell et al.
JOURNAL OF LASER APPLICATIONS (2009)
Laser machining of structural ceramics-A review
Anoop N. Samant et al.
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY (2009)
Laser singulation of thin wafer: Die strength and surface roughness analysis of 80 μm silicon dice
Nitin Sudani et al.
OPTICS AND LASERS IN ENGINEERING (2009)
Insight into electronic mechanisms of nanosecond-laser ablation of silicon
Wladimir Marine et al.
JOURNAL OF APPLIED PHYSICS (2008)
Laser Dicing of Silicon: Comparison of Ablation Mechanisms with a Novel Technology of Thermally Induced Stress
Oliver Haupt et al.
JOURNAL OF LASER MICRO NANOENGINEERING (2008)
Ultraviolet femtosecond, picosecond and nanosecond laser microstructuring of silicon: structural and optical properties
V. Zorba et al.
APPLIED OPTICS (2008)
Thin silicon wafer dicing with a dual-focused laser beam
Krishnan Venkatakrishnan et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2007)
Ablation and cutting of silicon wafer and micro-mold fabrication using femtosecond laser pulses
Ying Wang et al.
JOURNAL OF LASER APPLICATIONS (2007)
Deep drilling on a silicon plate with a femtosecond laser: experiment and model analysis
T. Matsumura et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2007)
Doping of silicon with carbon during laser ablation process
G. Raciukaitis et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2006)
Thermo-Elastic-Plastic Analysis on Internal Processing Phenomena of Single-Crystal Silicon by Nanosecond Laser
Takeshi Monodane et al.
JOURNAL OF LASER MICRO NANOENGINEERING (2006)
Femtosecond laser machining of single-crystal superalloys through thermal barrier coatings
Q. Feng et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2006)
Laser ablation of silicon wafer with a water microdrop
Kouki Shimizu et al.
JOURNAL OF LASER APPLICATIONS (2006)
Laser helical drilling of silicon wafers with ns to fs pulses: Scanning electron microscopy and transmission electron microscopy characterization of drilled through-holes
J. Kaspar et al.
JOURNAL OF LASER APPLICATIONS (2006)
Time-resolving image analysis of drilling of thin silicon substrates with femtosecond laser ablation
A Yokotani et al.
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS (2005)
Femtosecond laser micromachining of grooves in silicon with 800 nm pulses
THR Crawford et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2005)
Femtosecond versus nanosecond laser machining: comparison of induced stresses and structural changes in silicon wafers
MS Amer et al.
APPLIED SURFACE SCIENCE (2005)
Experimental investigation of ablation efficiency and plasma expansion during femtosecond and nanosecond laser ablation of silicon
X Zeng et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2005)
Comparison of structure and properties of femtosecond and nanosecond laser-structured silicon
CH Crouch et al.
APPLIED PHYSICS LETTERS (2004)
Underwater and water-assisted laser processing: Part 1 - general features, steam cleaning and shock processing
A Kruusing
OPTICS AND LASERS IN ENGINEERING (2004)
Underwater and water-assisted laser processing: Part 2 - Etching, cutting and rarely used methods
A Kruusing
OPTICS AND LASERS IN ENGINEERING (2004)
Electronic mechanism of ion expulsion under UV nanosecond laser excitation of silicon: Experiment and modeling
W Marine et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2004)
Femtosecond laser interaction with silicon under water confinement
G Daminelli et al.
THIN SOLID FILMS (2004)
Laser beam machining (LBM), state of the art and new opportunities
J Meijer
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2004)
Modelling of heat transfer in waterjet guided laser drilling of silicon
CF Li et al.
PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE (2003)
Laser-induced explosive boiling during nanosecond laser ablation of silicon
V Craciun et al.
APPLIED SURFACE SCIENCE (2002)
Laser ablation of solid substrates in a water-confined environment
S Zhu et al.
APPLIED PHYSICS LETTERS (2001)
Effect of energy above laser-induced damage thresholds in the micromachining of silicon by femtosecond pulse laser
BKA Ngoi et al.
OPTICS AND LASERS IN ENGINEERING (2001)
Ultrafast laser micromachining of silica aerogels
J Sun et al.
JOURNAL OF NON-CRYSTALLINE SOLIDS (2001)
Submicron micromachining on silicon wafer using femtosecond pulse laser
BKA Ngoi et al.
JOURNAL OF LASER APPLICATIONS (2001)
Explosive change in crater properties during high power nanosecond laser ablation of silicon
JH Yoo et al.
JOURNAL OF APPLIED PHYSICS (2000)
Evidence for phase-explosion and generation of large particles during high power nanosecond laser ablation of silicon
JH Yoo et al.
APPLIED PHYSICS LETTERS (2000)