Related references
Note: Only part of the references are listed.Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging
Changchang Wang et al.
ACTA METALLURGICA SINICA-ENGLISH LETTERS (2020)
Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain
Flora Somidin et al.
MATERIALS CHARACTERIZATION (2018)
High-Speed Cu Electrodeposition and Reliability of Cu Pillar Bumps in High-Temperature Storage
P. T. Lee et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2018)
Growth competition between layer-type and porous-type Cu3Sn in microbumps
David T. Chu et al.
MICROELECTRONICS RELIABILITY (2017)
Effect of Ni on growth kinetics, microstructural evolution and crystal structure in the Cu(Ni)-Sn system
Varun A. Baheti et al.
PHILOSOPHICAL MAGAZINE (2017)
Intermetallic compounds in 3D integrated circuits technology: a brief review
Syahira Annuar et al.
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS (2017)
Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 μm diameter
Yingxia Liu et al.
ACTA MATERIALIA (2016)
Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review
D. K. Mu et al.
CURRENT OPINION IN SOLID STATE & MATERIALS SCIENCE (2016)
Microstructural Evolution of Cu/Solder/Cu Pillar-Type Structures with Different Diffusion Barriers
Hsi-Kuei Cheng et al.
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE (2016)
Flux-driven cellular precipitation in open system to form porous Cu3Sn
Andriy M. Gusak et al.
PHILOSOPHICAL MAGAZINE (2016)
Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints
Jie-An Lin et al.
CRYSTALS (2016)
Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration
M. L. Huang et al.
ACTA MATERIALIA (2015)
2015 MRS Spring Meeting highlights innovations and discoveries
[Anonymous]
MRS BULLETIN (2015)
Materials challenges in three-dimensional integrated circuits
Kuan-Neng Chen et al.
MRS BULLETIN (2015)
Vertical interconnects of microbumps in 3D integration
Chih Chen et al.
MRS BULLETIN (2015)
EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing
S. J. Wang et al.
JOURNAL OF ELECTRONIC MATERIALS (2014)
Structure and properties of lead-free solders bearing micro and nano particles
Liang Zhang et al.
MATERIALS SCIENCE & ENGINEERING R-REPORTS (2014)
Degradation of Cu6Sn5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn microbump interconnects
Luliana Panchenko et al.
MICROELECTRONIC ENGINEERING (2014)
Introduction of an Electroless-Plated Ni Diffusion Barrier in Cu/Sn/Cu Bonding Structures for 3D Integration
Byunghoon Lee et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2012)
On the root cause of Kirkendall voiding in Cu3Sn
Liang Yin et al.
JOURNAL OF MATERIALS RESEARCH (2011)
Kinetics of the η-η′ transformation in Cu6Sn5
K. Nogita et al.
SCRIPTA MATERIALIA (2011)
Effects of residual S on Kirkendall void formation at Cu/Sn-3.5Ag solder joints
Jin Yu et al.
ACTA MATERIALIA (2008)
Effect of Stress State on Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Cu Substrates Coated with Electroless Ni Immersion Au
S. L. Ngoh et al.
JOURNAL OF ELECTRONIC MATERIALS (2008)
Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn-Cu-Ni lead-free solder alloys
Kazuhiro Nogita et al.
SCRIPTA MATERIALIA (2008)
First-principles investigation of the structural and electronic properties of Cu6-xNixSn5 (x=0, 1, 2) intermetallic compounds
Chun Yu et al.
INTERMETALLICS (2007)
Design of solder joints for fundamental studies on the effects of electromigration
C. E. Ho et al.
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS (2007)
Phase stability, phase transformations, and elastic properties of Cu6Sn5:: Ab initio calculations and experimental results
G Ghosh et al.
JOURNAL OF MATERIALS RESEARCH (2005)
Interfacial reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu, and Sn/(Cu,Ni) systems
SW Chen et al.
JOURNAL OF ELECTRONIC MATERIALS (2003)
Interfacial microstructure and the kinetics of interfacial reaction in diffusion couples between Sn-Pb solder and Cu/Ni/Pd metallization
G Ghosh
ACTA MATERIALIA (2000)