Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 32, Issue 18, Pages 23090-23102Publisher
SPRINGER
DOI: 10.1007/s10854-021-06792-8
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In this study, the surface of glass fiber was modified using the sol-gel method to enhance the performance of PTFE/GF composites. The PTFE/T-GF composites showed improved dielectric properties, bending strength, thermal conductivity, and lower CTE, making them suitable for high-frequency PCB substrate materials.
PTFE/GF(glass fiber) composites are widely applied in high-frequency printed circuit board (PCB) substrate materials due to the excellent dielectric properties of PTFE and the low thermal expansion coefficient of GF. However, the poor interface compatibility between PTFE and GF affects the performance of the composite substrates. In this study, tetraethyl orthosilicate (TEOS) was used as the silicon source, and polydimethylsiloxane (PDMS) was the organic precursor to modify the surface of GF through the sol-gel method to promote the interface compatibility of GF and PTFE. The modified GF noted T-GF was filled in PTFE to prepare PTFE/T-GF composites. SEM, FTIR, XPS, and contact angle confirmed that organic-inorganic hybrids were successfully loaded on GF's surface. Moreover, compared with PTFE/GF and the conventional coupling agent modified GF filled PTFE composites, the PTFE/T-GF exhibited improved dielectric constant (2.305), decreased dielectric loss (9.08E(-4)), higher bending strength (21.45 MPa) and bending modulus (522 MPa), better thermal conductivity (0.268 W/m*K) and lower CTE (70 ppm/degrees C), making it has promising application as the substrate materials for high frequency PCB.
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