An improved design for e-mode AlGaN/GaN HEMT with gate stack β-Ga2O3/p-GaN structure

To improve the performance of the conventional p-GaN gate AlGaN/GaN high electron mobility transistors (HEMTs), we propose an improved design for e-mode AlGaN/GaN HEMT with a gate stack beta-Ga2O3/p-GaN structure. The simulated results show that the proposed device increases the threshold voltage and the gate breakdown voltage in comparison with the conventional p-GaN gate HEMT due to the use of the beta-Ga2O3 layer, which has an additional beta-Ga2O3/p-GaN heterojunction and decreases the strength of electric field in the gate region. Moreover, the proposed device exhibits a lower off-state leakage current, which can be attributed to the less donor ionized density. In addition, the impacts of the beta-Ga2O3 layer thickness are investigated. There is a trade-off between beta-Ga2O3 layer thickness and the performance of the proposed device, including threshold voltage, gate breakdown, and saturation drain current. Published under an exclusive license by AIP Publishing.

Automated summary

The improved e-mode AlGaN/GaN HEMT with a gate stack beta-Ga2O3/p-GaN structure outperforms the conventional p-GaN gate HEMT, mainly due to the use of the beta-Ga2O3 layer which reduces the electric field strength in the gate region and decreases off-state leakage current. Additionally, there is a trade-off between the thickness of the beta-Ga2O3 layer and the performance of the device.