The thermal and mechanical properties of thermosetting composites prepared for welding by the improved TP hybrid interlayer

The approach for joining carbon fiber reinforced epoxy (CF/Epoxy) composites proposed in this study is based on the use of a plasticizing chip (PC), one side with rich resin and the other side with bare fiber, prepared by 1, 2, 3 or 4 pieces of glass fiber reinforced polyetherimide (GF/PEI) prepregs and a piece of glass fiber cloth (GFC), added as a last ply in the stacking sequence of CF/Epoxy composites. During curing, the epoxy partially penetrates in the side with a bare fiber of PC, leading to micro-mechanical interlocking as the main connection mechanism between the PC and the CF/Epoxy composites. To verify the effects of PC on the thermal and mechanical properties of CF/Epoxy composites, TGA, DMA, DCB, bending, interlaminar shear and drop-weight tests were carried out. The results showed that PC can effectively alleviate the impact of thermal degradation without weakening the properties of CF/Epoxy composites.

Automated summary

The study introduces a method for joining carbon fiber composites based on plasticizing chip technology, establishing micro-mechanical interlocking connection with CF/Epoxy composites through resin-rich and bare fiber sides in the plasticizing chip, along with the use of additional glass fiber materials. Thermal and mechanical properties testing confirmed the significant impact of the plasticizing chip in alleviating thermal degradation while maintaining the strength of CF/Epoxy composites.