Journal
INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS
Volume 28, Issue 11, Pages 1799-1810Publisher
SPRINGER
DOI: 10.1007/s12613-020-2163-4
Keywords
strain hardening; strain rate sensitivity; processing map; AISI 321 austenitic stainless steel; hot compression
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This study investigated the hot deformation behavior and microstructural evolution of AISI 321 austenitic stainless steel under different conditions using hot flow curves and strain hardening exponent. The results showed dynamic recovery, single and multiple peak dynamic recrystallization, and interactions between dynamic recrystallization and precipitation under different conditions.
Hot compression tests were performed on AISI 321 austenitic stainless steel in the deformation temperature range of 800-1200 degrees C and constant strain rates of 0.001, 0.01, 0.1, and 1 s(-1). Hot flow curves were used to determine the strain hardening exponent and the strain rate sensitivity exponent, and to construct the processing maps. Variations of the strain hardening exponent with strain were used to predict the microstructural evolutions during the hot deformation. Four variations were distinguished reflecting the different microstructural changes. Based on the analysis of the strain hardening exponent versus strain curves, the microstructural evolutions were dynamic recovery, single and multiple peak dynamic recrystallization, and interactions between dynamic recrystallization and precipitation. The strain rate sensitivity variations at an applied strain of 0.8 and strain rate of 0.1 s(-1) were compared with the microstructural evolutions. The results demonstrate the existence of a reliable correlation between the strain rate sensitivity values and evolved microstructures. Additionally, the power dissipation map at the applied strain of 0.8 was compared with the resultant microstructures at predetermined deformation conditions. The microstructural evolutions strongly correlated to the power dissipation ratio, and dynamic recrystallization occurred completely at lower power dissipation ratios.
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