The machining accuracy and surface roughness of mono-crystalline silicon regarding wire lag and wire stiffness of endless diamond wire

Article Materials Science, Ceramics

Surface generation mechanism of ceramic matrix composite in ultrasonic assisted wire sawing

Lutao Yan et al.

Summary: By combining ultrasonic assisted cutting and diamond wire sawing, this study successfully improves cutting performance and surface quality of CMC material, reduces cutting force and tool wear, and enhances surface characteristics and shape accuracy.

CERAMICS INTERNATIONAL (2021)

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Article Energy & Fuels

Analysis of crack-free surface generation of photovoltaic polysilicon wafer cut by diamond wire saw

Youkang Yin et al.

Summary: Through establishing a mathematical model and conducting experimental verification, this research analyzed the influence of different parameters in diamond wire sawing process. It was found that reducing the workpiece feed speed or increasing the saw wire movement speed is more conducive to obtaining a crack-free sawn surface, with the latter playing a greater role in affecting the surface quality of the sawn surface.

SOLAR ENERGY (2021)

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Article Engineering, Electrical & Electronic

Fabrication of thin resin-bonded diamond wire and its application to ductile-mode wire sawing of mono-crystalline silicon

Mengran Ge et al.

Summary: Thin resin-bonded diamond wire with a core wire diameter of 60 μm was developed and evaluated for its morphology and sawing performance. A 3D morphology model was established to determine wire sawing parameters.

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (2021)

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Article Engineering, Mechanical