Journal
IEEE TRANSACTIONS ON POWER DELIVERY
Volume 36, Issue 3, Pages 1440-1448Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TPWRD.2020.3008997
Keywords
Switchgear; Copper; Low voltage; Conductors; Standards; Current density; Finite element analysis; Finite element method; low-voltage switchgear; thermal engineering
Categories
Ask authors/readers for more resources
This study focuses on the thermal design of a low-voltage switchgear based on a laminated bus plate structure. Thermal network and finite element simulations were used to understand the thermal behavior of different parts of the system, leading to the design and sizing of conductors. The thermal performance was confirmed through temperature rise tests.
This work describes the thermal design of a low-voltage switchgear based on a bus plate formed by a laminated bus plate structure. It has been done within the frame of developing a new generation of low voltage switchgear system, and the main goal was to provide the scientific verification of the new bus plate concept. The work consisted of thermal network and finite element simulations, aiming to gain understanding of the thermal behavior of the different parts of the system, and leading to the design and dimensioning of the conductors. The thermal performance has been confirmed by temperature rise tests.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available