Journal
IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume 68, Issue 9, Pages 4237-4241Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2021.3100012
Keywords
AC loss; laminations; microinductor; power supply on chip (PwrSoC); thin film inductor
Funding
- Zhejiang Provincial Natural Science Foundation [LD21F040001]
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This work introduces a stacked winding thin film magnetic core microinductor to enhance the ratio of inductance to dc resistance (DCR) and presents an improved ac winding loss model. The study demonstrates that the total DCR of the stacked winding inductor is reduced by approximately 25% compared to the corresponding single layer structure with equivalent inductance and device area.
In this work a stacked winding thin film magnetic core microinductor is proposed to improve the ratio of inductance to dc resistance (DCR). This article also describes an improved ac winding loss model accounting for the asymmetric 2-D magnetic fields present within the device. Two six-turn single layer and stacked winding devices are fabricated, and small signal measurements are presented with dc inductance of 150 nH and DCR of 0.35 Omega for the stacked winding inductor, and with DCR of 0.47 Omega for the single winding inductor. In this case, the total DCR of stacked winding inductor is reduced by approximately 25% compared with the corresponding single layer structure with an equivalent inductance and device area.
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