Journal
IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION
Volume 28, Issue 4, Pages 1468-1470Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TDEI.2021.009620
Keywords
Temperature distribution; Photonic band gap; Glass; Power system stability; Dielectrics; Polymers; Electric fields; polymer dielectric; band gap; high electric field; elevated temperature; conduction
Funding
- ONR [N00014-17-1-2656, N0014-19-1-2340]
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In this paper, a unified principle for designing flexible, high temperature polymer dielectrics is proposed, focusing on introducing specific structural units to increase bandgap and maintain thermal stability. Experimental results demonstrate that this method can achieve low conduction current under high electric field and elevated temperatures.
Polymer dielectrics essentially revolutionized the electrical power system, pervasively used in nearly all the key electronic and electrical devices, due mainly to their suitably large bandgaps. However, insufficient attention has been paid to the bandgap in the design of new polymer dielectrics for high temperatures. In this paper, we present a unified principle for the design of flexible, high temperature polymer dielectrics. As exemplified by our recently discovered poly(oxa)norbornenes (POFNB), saturated bicyclics with varying carbonyl and ether groups in the bicyclic repeat units, connected by unconjugated alkenes and freely rotatable single bonds in conjunction with freely rotating fluorinated benzene ring side-groups, can impart flexibility yet retain thermal stability while providing large bandgaps to olefinic polymers. The results indicate that POFNB has stably low conduction current under concurrent high electric field and elevated temperatures beneficial from its large band gap of similar to 5 eV and high glass transition temperature of 186 degrees C.
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