Characterization of Transport Current Behavior in the Soldered Joint Area of HTS Tapes Using Magnetization Distribution Measurement

Using 2D mapping of three components of magnetic field data, we successfully obtained transport current profiles at the solder joint area of GdBCO tapes, by solving the inverse problem. Contrary to the expectation that the current will be transferred uniformly over the entire joint, the measurement showed the transfer current was concentrated at the downstream side of the joint edge. This observation suggests that it is necessary to carefully check not only the joint resistance but also at the current distribution.

Automated summary

By mapping the magnetic field data of three components, transport current profiles at the solder joint area of GdBCO tapes were successfully obtained, revealing a non-uniform current distribution at the joint edge. It is essential to carefully inspect both joint resistance and current distribution based on this observation.