4.6 Article

The dimension splitting interpolating element-free Galerkin method for solving three-dimensional transient heat conduction problems

Journal

ENGINEERING ANALYSIS WITH BOUNDARY ELEMENTS
Volume 128, Issue -, Pages 326-341

Publisher

ELSEVIER SCI LTD
DOI: 10.1016/j.enganabound.2021.04.016

Keywords

Meshless method; Interpolating moving least-squares method; Dimension splitting interpolating element-free; Galerkin method; Dimension splitting method; Finite difference method; Transient heat conduction problem

Funding

  1. National Natural Science Foundation of China [11571223]

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This paper introduces a dimension splitting interpolating element-free Galerkin (DSIEFG) method for solving 3D transient heat conduction problems. By splitting the problem domain and using the improved interpolating moving least-squares method, DSIEFG is able to directly apply boundary conditions, improving computational accuracy and efficiency.
In this paper, based on dimension splitting method and the improved interpolating moving least-squares (IMLS) method, a dimension splitting interpolating element-free Galerkin (DSIEFG) method for three-dimensional (3D) transient heat conduction problems is proposed. The main idea of the DSIEFG method is to split a 3D problem domain into a series of related two-dimensional (2D) subdomains. The improved IMLS method is used to construct shape function on 2D subdomains. Finite difference method is used to couple these discretized equations on 2D subdomains and employed in the time domain. Compared with the improved element-free Galerkin (IEFG) method, the advantage of the DSIEFG method is that the essential boundary conditions can be applied directly, which can improve computational accuracy and efficiency. Six examples are chosen to verify the effectiveness and efficiency of the DSIEFG method. The results of DSIEFG are compared with the numerical solutions of the IEFG method, and it is shown that the efficiency and precision of the DSIEFG method are greater than ones of the IEFG method for 3D transient heat conduction problems.

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