Effect of abrasive particle shape on the development of silicon substrate during nano-grinding

The interactions between silicon substrate and abrasive particles are the important mechanical process during nano-grinding. We conducted the molecular dynamics simulations to explore the influence of the different abrasive particle shapes ?the common as-synthesized diamond shapes (cubic, cubo-octahedral, and octahedral) ?on the macro real-time observables, including grinding force, temperature, roughness, subsurface damage, material removal rate, and XRD spectra, from the atom-level insight. The results show that the different shapes might produce a different effect during the nano-grinding. According to the required demand, the different particle shapes could tend to be considered. For example, the cubo-octahedral was suitable for the rough nanogrinding; the octahedral was suitable for the finish nano-grinding. The results of this study might provide an atom-level optimal strategy.

Automated summary

The molecular dynamics simulations showed that different shapes of abrasive particles have different effects during nano-grinding, with cubo-octahedral being suitable for rough nanogrinding and octahedral being suitable for finish nano-grinding. This study provides an atom-level optimal strategy for selecting abrasive particle shapes based on specific processing requirements.