Journal
CERAMICS INTERNATIONAL
Volume 47, Issue 18, Pages 26519-26527Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.ceramint.2021.06.065
Keywords
3D printing; Porous alumina; Hollow structure; Mechanical properties; Thermal insulation properties
Categories
Funding
- Beijing Municipal Science and Technology Project [KM202010005003]
- General Program of Sci-ence and Technology Development Project of Beijing Municipal Edu-cation Commission
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The study utilized DLP 3D printing technology to prepare two configurations of alumina (Al2O3) ceramics. The solid lattice structure exhibited higher compressive strength compared to the hollow lattice structure, with the latter showing potential in reducing heat loss and improving energy efficiency. These findings suggest potential industrial applications for the hollow lattice structure Al2O3 ceramics formed using DLP technology.
In this study, two configurations of alumina (Al2O3) ceramics (hollow lattice structure and solid lattice structure) were prepared by DLP 3D printing technology. When sintered at 1600 degrees C for 4 h, dense alumina ceramics with an average grain size of 4.38 +/- 1.26 mu m can be obtained. The Al2O3 ceramics prepared by DLP process have good forming precision and shape. The dimension error can be controlled about 0.2 mm. The compressive strength of solid block is 572 MPa. The maximum compressive strength of solid lattice (2.0 mm in diameter and 45% in porosity) is 9.70 MPa. The maximum compressive strength of hollow lattice (2.0 mm in diameter, 0.3 mm in thickness and 70% in porosity) is 4.30 MPa. The thermal simulation results show that the temperature of the hollow lattice (diameter 1.2 mm, porosity 76%) with 500 degrees C upper surface transferring to the lower surface is only 88.6 degrees C, which is lower than 133 degrees C of the solid lattice. Hollow lattice structure can effectively reduce heat loss and improve energy efficiency. The hollow lattice structure Al2O3 ceramics formed by DLP technology is expected to be used in industrial thermal insulation applications.
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