4.7 Article

Impact of the SiC addition on the morphological, structural and mechanical properties of Cu-SiC composite powders prepared by high energy milling

Journal

ADVANCED POWDER TECHNOLOGY
Volume 32, Issue 8, Pages 2950-2961

Publisher

ELSEVIER
DOI: 10.1016/j.apt.2021.06.006

Keywords

High Energy Milling (HEM); Cu-SiC composite powder; Microstructure; Magnetic properties; Mechanical property

Funding

  1. CAPES
  2. CNPq [309430/2019-4, 313337/2018-7]

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The study investigated the effect of SiC content on the microstructural, mechanical, and magnetic properties of Cu-SiC composite powders. Results showed that with increasing SiC content, Cu particles deformed severely, forming composite particles with reduced average particle size and crystallite sizes, as well as changes in hardness and magnetic behavior.
The effect of the SiC content on the microstructural, mechanical, and magnetic properties of Cu(1 -x)SiC (x) composite powders (x = 0, 2, 10 and 15 wt%) prepared by high energy milling for 30 h was investi-gated. The results showed that Cu particles were severely deformed and formed plate like particles of dif-ferent sizes, while SiC particles were fragmented and embedded in the Cu phase, thus, forming composite particles. As the SiC content increased, the average particle size decreased from 40.75 to 12.84 mm. Besides, XRD data showed a decrease in the crystallite sizes of the Cu phase (from 23.66 to 21.56 nm), accompanied by an increase in the lattice micro-strain (from 0.41 to 0.46%). Changes in the lattice param-eters of the Cu phase were observed. The Vickers microhardness were measured in compacted powder samples and reached a maximum value of 135.22 HV for the sample with 15 wt% SiC. The samples showed hysteresis magnetic behavior at 300 K, and with a maximum saturation magnetization of 0.123 emu/g. The weak magnetic signal is mainly due to Co impurities present in the WC from the milling media. (c) 2021 The Society of Powder Technology Japan. Published by Elsevier B.V. and The Society of Powder Technology Japan. All rights reserved.

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