4.8 Article

Inherently UV Photodegradable Poly(methacrylate) Gels

Journal

ADVANCED FUNCTIONAL MATERIALS
Volume 31, Issue 49, Pages -

Publisher

WILEY-V C H VERLAG GMBH
DOI: 10.1002/adfm.202105681

Keywords

lubricant-infused surfaces; organogels; photodegradation; positive photoresist; UV light

Funding

  1. DBU (Deutsche Bundesstiftung Umwelt)
  2. CSC (China Scholarship Council)
  3. DFG [LE 2936/9-1]
  4. Projekt DEAL

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Organogels, soft materials based on polymeric networks swollen in organic solvents, are hydrophobic and have high solvent content. Control of shape and surface structure is necessary for functional organogels. Poly(methacrylate) organogels have inherent UV photodegradability, with low UV absorbance and high swelling ability of the solvent infusing the organogel contributing to fast photodegradation.
Organogels (hydrophobic polymer gels) are soft materials based on polymeric networks swollen in organic solvents. They are hydrophobic and possess a high content of solvent and low surface adhesion, rendering them interesting in applications such as encapsulants, drug delivery, actuators, slippery surfaces (self-cleaning, anti-waxing, anti-bacterial), or for oil-water separation. To design functional organogels, strategies to control their shape and surface structure are required. Herein, the inherent UV photodegradability of poly(methacrylate) organogels is reported. No additional photosensitizers are required to efficiently degrade organogels (d approximate to 1 mm) on the minute scale. A low UV absorbance and a high swelling ability of the solvent infusing the organogel are found to be beneficial for fast photodegradation, which is expected to be transferrable to other gel photochemistry. Organogel arrays, films, and structured organogel surfaces are prepared, and their extraction ability and slippery properties are examined. Films of inherently photodegradable organogels on copper circuit boards serve as the first ever positive gel photoresist. Spatially photodegraded organogel films protect or reveal copper surfaces against an etchant (FeCl3 aq.).

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