Journal
ACS APPLIED MATERIALS & INTERFACES
Volume 13, Issue 39, Pages 47244-47251Publisher
AMER CHEMICAL SOC
DOI: 10.1021/acsami.1c14049
Keywords
plasma jet sintering; atmospheric pressure; low temperature; flexible electronics; aerosol jet printing
Funding
- US Air Force Office of Scientific Research [FA955018-1-0157]
- Department of Energy [DEEE0009103]
- National Science Foundation [CMMI-1747685]
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The passage discusses the application of atmospheric pressure nonthermal plasmas in sintering printed films, demonstrating the surface modifications achieved through nonthermal plasmas under ambient conditions. These results offer a new direction for future electronic device manufacturing, showcasing the potential of utilizing nonthermal plasmas for additive manufacturing on flexible and low-melting-point materials.
Atmospheric pressure nonthermal plasmas hold great promise for applications in environmental control, energy conversion, and material processing. Even at room temperature, nonthermal plasmas produce energetic and reactive species that can initiate surface modifications at a plasma-surface interface, including thin-film nanoparticle assemblies, in a nondestructive and effective way. Here, we present the plasma-activated sintering of aerosol jet printed silver thin films on substrates ranging from glass to delicate materials including blotting paper, fruits, and flexible plastic. We characterize the microstructural evolutions and electrical properties of printed films along with the electrical, thermal, and optical properties of an argon plasma jet. We demonstrate an electrical conductivity as high as 1.4 x 10(6) S/m for printed films sintered under atmospheric conditions in which the surface temperature stays below 50 degrees C. These results highlight a future direction where additive manufacturing of electronic devices can be achieved on flexible and low-melting-point materials under ambient conditions without requiring additional thermal processing by utilizing nonthermal plasmas.
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