Mechanical Properties and Thermal Stability of the High-Thermoelectric-Performance Cu2Se Compound

The Cu2Se compound possesses extraordinary thermoelectric performance at high temperatures and shows great potential for the application of waste heat recycling. However, a thermoelectric device usually undergoes mechanical vibration, mechanical and/or thermal cycling, and thermal shock in service. Therefore, mechanical properties are of equal importance as thermoelectric performance. However, the mechanical performance and stability of the Cu2Se compound during long-term service at high temperatures have rarely been reported. In this study, we systematically investigated the mechanical properties of Cu2Se compounds synthesized by three varied methods (melting (M), self-propagating high-temperature synthesis (SHS), and a combination of SHS and ultrasonic treatment (UT)) and investigated the thermal stability of the SHS-UT compound under different annealing temperatures. The SHS-UT process effectively refines the grain size from 19 mu m for the melting sample to 5 mu m for the SHS-UT sample. The high density of grain boundaries in the SHS-UT sample effectively dissipates the energy of crack propagation; thus, the mechanical properties are greatly improved. The compressive strength, bending strength, and Vickers hardness of the SHS-UT sample are 147 MPa, 52.6 MPa, and 0.46 GPa, respectively, which are 21.5, 16.6, and 35.3% higher than those of the melting sample, respectively. Moreover, excellent thermal stability is achieved in the compound prepared by SHS and ultrasonication at a temperature below 873 K. After annealing at temperatures up to 873 K for 7 days, the excellent thermoelectric performance of the Cu2Se compound is well maintained with a ZT value exceeding 1.80 at 873 K. However, with further increasing the annealing temperature to 973 K, the volatilization of Se and the precipitation of Cu result in the instability and significantly deteriorated thermoelectric performance of the material. This work provides an avenue for boosting the mechanical properties and commercial application of Cu2Se.

Automated summary

The mechanical properties and stability of Cu2Se compound at high temperatures were systematically investigated in this study, with the SHS-UT sample showing significantly improved mechanical properties and excellent thermal stability. The SHS-UT process effectively refined the grain size and increased grain boundary density, leading to enhanced compressive strength, bending strength, and Vickers hardness. Additionally, the compound prepared by SHS and ultrasonication demonstrated outstanding thermal stability at temperatures below 873 K, maintaining excellent thermoelectric performance with a ZT value exceeding 1.80.