4.7 Article

Residual stresses in additively manufactured AlSi10Mg Raman spectroscopy and X-ray diffraction analysis

Journal

MATERIALS & DESIGN
Volume 202, Issue -, Pages -

Publisher

ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2021.109550

Keywords

Residual stress; X-ray diffraction (XRD); Raman spectroscopy; AlSi10Mg; Additive Manufacturing

Funding

  1. Regione Piemonte through project STAMP (Sviluppo Tecnologico dell'Additive Manufacturing in Piemonte)

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This study utilized two non-destructive techniques, Raman spectroscopy and XRD method, to determine residual stresses in AlSi10Mg alloy samples. The results show that both methods can effectively evaluate the residual stresses of Al and Si in the alloy.
Metal parts produced by Additive Manufacturing, and in particular Laser Powder Bed Fusion (LPBF), suffer from residual stresses due to high thermal gradients causing cyclic expansion and contraction of the alloy. This work deals with the determination of residual stress in rapidly solidified AlSi10Mg samples using two non-destructive techniques: Raman spectroscopy, rapid, unconventional but applicable to Al\\Si alloys, and XRD (w-method), used as benchmark, being a classical method for determining residual stresses. Al stress level was studied by XRD both on the surface of LPBF samples and in the interior, after in-depth sectioning. Raman was employed to assess the stress on Si. The effect of particle size and stress on the Raman was separated determining the size distribution of Si particles, making Raman suitable to study residual stresses in alloys containing free Si. Al and Si stresses were evaluated also by means of the Williamson-Hall method: stresses are of tensile type with agreement among all methods. Considering the alloy as a composite, stress on Si was estimated using the Eshelby's model, showing that larger eutectic particles undergo lower stress with respect to nanometric precipitates. (C) 2021 The Authors. Published by Elsevier Ltd. This is an open access article under the CC BY license (http:// creativecommons.org/licenses/by/4.0/).

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