Journal
JOURNAL OF MANUFACTURING PROCESSES
Volume 64, Issue -, Pages 276-284Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.jmapro.2021.01.030
Keywords
Soldering; Ultrasonics; Wettability; Automation
Categories
Funding
- NSF-INTERN program [CBET1750208]
- L3Harris
Ask authors/readers for more resources
Ultrasonic-assisted soldering enhances the metal-to-glass bond by increasing wettability of the solder line. Experimental results show that wettability is influenced by ultrasonic power and solder tip height, due to acoustic radiation pressure. A capillary shape equation incorporating acoustic radiation pressure can accurately predict solder bead geometry.
Ultrasonic-assisted soldering (UAS) creates an enhanced metal-to-glass bond that is linked to the increased wettability of the solder line. Precision experiments are performed using an automated UAS system, with precise control over a large number of experimental parameters, to investigate the wetting properties of solder to glass. Results show that wettability is increased with (i) increasing ultrasonic power and (ii) decreasing solder tip height above substrate, both of which are linked to the acoustic radiation pressure delivered by the vibrating solder tip to the liquid solder melt. Surface tension forces dominate the mechanics and a capillary shape equation is derived that includes the effect of acoustic radiation pressure. Numerical solutions to the capillary shape equation compare well with experimental observations, suggesting the solder bead geometry can be predicted a priori from the model.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available