A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

Metal nanoparticles (NPs) have attracted growing attention in recent years for electronic packaging applications. Ag NPs have emerged as a promising low-temperature bonding material owing to their unique characteristics. In this study, we mainly review our research progress on the interconnection of using polyol-based Ag NPs for electronic packaging. The synthesis, sintering-bonding process, bonding mechanism, and high-temperature joint properties of Ag NP pastes are investigated. The paste containing a high concentration of Ag NPs was prepared based on the polyol method and concentration. A nanoscale layer of organic components coated on the NPs prevents the coalescence of Ag NPs. The effects of organic components on the bondability of the Ag NP paste were studied. Compared to the aqueous-based Ag NP paste, the polyol-based Ag NP with the reduction of organic component can improve the bondability, and the coffee ring effect was successfully depressed due to the increased Marangoni flow. The sintering behaviors of Ag NPs during the bonding process were investigated using the classical sphere-to-sphere approach. The mechanical property of joints using this Ag paste was better than that using Pb95Sn5 solders after storage at high temperatures. The sintering-bonding technology using polyol-based Ag NPs was helpful to the low-temperature interconnection for electronic packaging applications.

Automated summary

This study mainly reviews the application of polyol-based silver nanoparticles in electronic packaging, showing that the paste containing a high concentration of Ag NPs has good bondability and high-temperature properties. By reducing organic components, the polyol-based Ag NP paste can enhance bondability and suppress the coffee ring effect, with better mechanical properties of joints than lead-based solders after high-temperature storage. The sintering-bonding technology using polyol-based Ag NPs is helpful for low-temperature interconnection in electronic packaging applications.