Copper fractal growth during recycling from waste printed circuit boards by slurry electrolysis

Superfine copper particles could be directly prepared from waste printed circuit boards by slurry electrolysis. Meanwhile, copper fractal growth could be observed. To better understand this phenomenon, the factors that affect copper dendrites in a point-cathode system were discussed in detail. These results showed that the fractal degree of copper dendrites increased as the increase of applied voltage and the decrease of copper sulfate and gelatin concentrations. Sodium lauryl sulfate and hydrochloric acid concentrations could not significantly impact the fractal degree of copper dendrites, while gelatin concentration could. The minimum copper fractal dimension was 1.069 when gelatin and copper sulfate concentration was 120 mg/L and 0.1 mol/L, respectively with an applied voltage of 11 V. Moreover, the results diffusion-limited aggregation model demonstrated that particle translational speed, particle numbers and binding probability significantly affected copper dendrite patterns. The scanning electron microscopy results indicated that the three additives greatly affected the refinement of the copper crystal. These findings contribute to enrich the theoretical study on metals recovery from e-waste by slurry electrolysis.

Automated summary

Superfine copper particles can be directly prepared from waste printed circuit boards by slurry electrolysis, with observed copper fractal growth. Factors affecting copper dendrites were discussed in detail, showing that gelatin concentration significantly impacts fractal degree. The diffusion-limited aggregation model demonstrated that particle speed, number, and binding probability significantly affect copper dendrite patterns.