Fan-Out Panel-Level Packaging of Mini-LED RGB Display

In this study, the feasibility of mini-light-emitting diode (LED) RGB display fabricated by a chip-first fan-out panel-level packaging is investigated. Emphasis is placed on the design, materials, process, fabrication, and reliability of the mini-LED RGB display package on a printed circuit board (PCB). The mini-LEDs under consideration and their sizes are red (125 x 250 x 100 mu m), green (130 x 270 x 100 mu m), and blue (130 x 270 x 100 mu m). The spacing among the RGB mini-LEDs is 80 mu m, the pixel-to-pixel spacing is also similar to 80 mu m, and the pixel pitch is 625 mu m. The temporary glass panel for making the redistribution layers (RDLs) of the package is 515 x 510 x 1.1 mm in size. To increase the SMT assembly yield on the PCB, the mini-LEDs are grouped into 4(2 x 2 pixels)-in-one surface mount device (SMD), that is, a total of 12 R, B, and G mini-LEDs. A PCB (132 mm x 77 mm) is designed and fabricated for the drop test of the mini-LED package. Thermal cycling of the mini-LED SMD PCB assembly is also performed by a nonlinear temperature- and time-dependent finite-element simulation.

Automated summary

This study investigates the feasibility of mini-LED RGB display fabricated by a chip-first fan-out panel-level packaging, focusing on design, materials, process, fabrication, and reliability. Different colors and sizes of mini-LEDs are considered, with detailed descriptions of spacing and pixel pitch. Additionally, mini-LEDs are grouped into SMD components to increase SMT assembly yield on the PCB.