Journal
TRIBOLOGY INTERNATIONAL
Volume 156, Issue -, Pages -Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.triboint.2020.106831
Keywords
CMP; Friction force; Pad asperity; Stick-slip
Categories
Funding
- National Natural Science Foundation of China [51991373, 51875078]
- National key Research and Development Program of China [2016YFB1102205]
- Science Fund for Creative Research Groups of NSFC of China [51621064]
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The study found that the material removal rate is related to the fluctuation of the friction force (stick-slip phenomenon) rather than the average coefficient of friction. Additionally, a waviness topography was observed on the polished surface, further confirming its origin from the stick-slip phenomenon.
A real-time coefficient of friction (COF) analysis method, in conjunction with an in-situ contact area measurement method, is used to determine the frictional and material removal behaviors induced by the micro-scale pad asperity. The results indicate that the material removal rate (MRR) shows no correlation with the average COF, but shows a strong relationship with the fluctuation of the friction force, i.e. the stick-slip phenomenon. Moreover, a waviness topography is observed on the polished surface, which is further verified to be raised from the stick-slip phenomenon. Futhermore, a micro-asperity scale model is established to explain the underlying mechanism of stick-slip phenomenon. The results provide some new insights into the material removal mechanisms and the real-time monitoring technology for the CMP process.
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