4.5 Article

Synthesis and thermal degradable property of novel tertiary ester-containing four-functional epoxy resin

Journal

POLYMERS FOR ADVANCED TECHNOLOGIES
Volume 32, Issue 9, Pages 3740-3749

Publisher

WILEY
DOI: 10.1002/pat.5393

Keywords

epoxy resin; reworkable; tertiary ester groups; thermal degradation

Funding

  1. Key Laboratory of Advanced Functional Composite Technology [6142906200111]
  2. National Natural Science Foundation of China [51703137]

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The FETE is a novel epoxy resin with high thermal degradation performance. By copolymerizing with TDE-85, the Tg of the copolymer can be adjusted and the compatibility can be improved, showing potential applications in reworkable electronic packaging, recycling or degradable epoxy resin area.
A kind of four-functional epoxy resin containing tertiary ester groups (FETE) was designed and synthesized by two-step reaction: first, the nucleophilic substitution reaction between linalool and isophthaloyl chloride, and then epoxidation. The chemical structure of obtained product was determined by infrared (IR) spectroscopy and nuclear magnetic resonance spectroscopy. Unlike traditional thermosetting epoxy resins, the cured FETE could degrade rapidly at low temperature (200-300 degrees C). Dynamic mechanical analysis analysis showed that through copolymerization of FETE with (4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester) epoxy resin (TDE-85), the glass transition temperature (Tg) of copolymer system could be adjusted in the range of 136-179 degrees C; FETE had good miscibility with TDE-85. The thermal degradation behavior of the copolymer system was studied by theoretical calculation, thermogravimetric (TG), and TG coupled with FTIR analysis, the results showed the thermal decomposition performance of the copolymer system could be adjusted in the range of 200-400 degrees C. The tertiary ester groups in FETE were easy to thermally degrade and caused the network skeleton of the copolymer system to collapse. The FETE would have good prospects in reworkable electronic packaging, recycling or degradable epoxy resin area.

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