Reducing metal/graphene contact resistance via N, N-dimethylacetamide-assisted clean fabrication process

Contact resistance (R (C) ) is of great importance for radio frequency (RF) applications of graphene, especially graphene field effect transistors (FETs) with short channel. FETs and transmission line model test structures based on chemical vapor deposition grown graphene are fabricated. The effects of employing traditional lithography solvent (Acetone) and strong solvents for photo resist, such as N, N-Dimethylacetamide (ZDMAC) and N-Methyl pyrrolidone (NMP), are systematically investigated. It was found that ZDMAC and NMP have more proficiency than acetone to remove the photo-resist residues and contaminations attached on graphene surface, enabling clean surface of graphene. However, strong solvents are found to destroy the lattice structure of graphene channel and induce defects in graphene lattice. Clean surface contributes to a significant reduction in the R (C) between graphene channel and metal electrode, and the defects introduced on graphene surface underneath metal electrodes also contribute the reduction of R (C) . But defects and deformation of lattice will increase the resistance in graphene channel and lead to the compromise of device performance. To address this problem, a mix wet-chemical approach employing both acetone and ZDMAC was developed in our study to realize a 19.07% reduction of R (C) , without an unacceptable mass production of defects.

Automated summary

The study found that using ZDMAC and NMP solvents can effectively remove surface residues in graphene, but may damage the lattice structure and introduce defects, impacting device performance.