Journal
MICROPOROUS AND MESOPOROUS MATERIALS
Volume 319, Issue -, Pages -Publisher
ELSEVIER
DOI: 10.1016/j.micromeso.2021.111059
Keywords
Carbon aerogel; Carbon foam; Thermal conductivity; Shrinkage; Copyrolysis mechanism
Categories
Funding
- National Key Research and Development Project of China [2016YFC0204205]
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This study developed a copyrolysis strategy to prepare carbon foam-reinforced carbon aerogels with low thermal conductivity. The composites exhibited higher compressive strength than carbon foam components, with the commercial carbon foam-reinforced carbon aerogels after copyrolysis at 900 °C showing the lowest high-temperature thermal conductivity. The mechanism of copyrolysis of RF aerogels and phenolic resin foams was analyzed using XPS, TGMS, and Fourier transform infrared spectrometer.
This paper reports a copyrolysis strategy for preparing carbon foam-reinforced carbon aerogels with low thermal conductivity. Three types of precarbonized foams derived from commercial (0.03 g/cm3), low-density (0.03 g/ cm3), and medium-density (0.06 g/cm3) phenolic resin foams were impregnated with resorcinol-formaldehyde (RF) sol, aged at 50 ?C, exchanged with ethanol, dried supercritically, and finally carbonized by copyrolysis at temperatures ranging from 600 to 900 ?C. The linear shrinkage characteristics during the pyrolysis of the aerogels, foams, and composites at different temperatures were measured to analyze the formation process of the gap at the composite interface. The compressive strength of the composites was found to be higher than that of the carbon foam components. The thermal conductivity of the three composites was gauged at temperatures ranging from 25 to 1900 ?C. The CCH-900 (commercial carbon foam-reinforced carbon aerogels after copyrolysis at 900 ?C) composite exhibited the lowest high-temperature thermal conductivity (?1900 ?C = 0.25 W/m?K). Finally, the copyrolysis mechanism of the RF aerogels and phenolic resin foams was analyzed through XPS, TGMS, and Fourier transform infrared spectrometer.
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