Journal
JOURNAL OF POWER SOURCES
Volume 495, Issue -, Pages -Publisher
ELSEVIER
DOI: 10.1016/j.jpowsour.2020.229424
Keywords
Photonic annealing; Thin-film batteries; Solid-state batteries; LiMn2O4; Crystallization
Funding
- Scientific Center for Optical and Electron Microscopy (ScopeM) of the Swiss Federal Institute of Technology (ETHZ)
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This research compared the effectiveness of photonic-based cathode crystallization methods (FLA and UV laser) with thermal annealing for LiMn2O4 thin-film cathodes, showing that FLA and UV laser can crystallize LMO cathodes in a shorter period of time and with comparable performance to thermal processing.
High temperature and prolonged thermal annealing for the crystallization of cathode in thin-film batteries (TFBs) restricts the choice of current collector and substrates and causes lithium loss in the cathode. This work explores photonic-based alternatives for cathode crystallization, specifically xenon flash-lamp annealing (FLA), ultraviolet excimer laser irradiation (UV-laser), and infrared laser (IR) annealing. The effect of these methods is systematically compared to that of thermal annealing in terms of processing time, crystal structure and electrochemical performance of the LiMn2O4 model thin-film cathode. FLA and UV excimer laser can crystallize LMO cathode in short periods of 6 min and 25 min, respectively, compared to the reference (ref.) thermal processing time of 60 min at 600 degrees C. The performance of the FLA-processed LMO cathodes (crystallinity, capacity, diffusion coefficient) is comparable to that of the thermal ref. with a capacity of 6 mu Ah cm(-2) and 5 mu Ah/cm(-2) at 15 C for FLA and thermal ref. respectively, with the practical limit of the 150 nm LMO film being 9.5 mu Ah cm(-2). A thinfilm FTO/LMO/Li(3)POxNy/Li solid-state battery was assembled and cycled at a high rate of 10 C with only a negligible capacity fade of 3.6% after 200 cycles. FLA can be used as an effective alternative for fast crystallization of thin-film cathodes on temperature-sensitive substrates and is suitable for upscaling processes.
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