4.6 Article

Thermal boundary conductance across solid-solid interfaces at high temperatures: A microscopic approach

Journal

JOURNAL OF APPLIED PHYSICS
Volume 129, Issue 19, Pages -

Publisher

AMER INST PHYSICS
DOI: 10.1063/5.0047396

Keywords

-

Funding

  1. National Key R&D Program of China [2017YFB0406004]
  2. National Natural Science Foundation of China [11890703]

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The paper proposes a simple mechanism to evaluate the TBC contributed by phonons at room temperatures by considering the mismatches of elastic modulus, atomic masses, and lattice spacing in the interface layers between two dissimilar solids. The theory explains well the observed magnitude of TBCs across various solid-solid interfaces in the range from 10(7) to 10(9)W m(-2) K-1, with coordination number density and energy transfer coefficient across interfaces identified as key parameters.
The existing theories for the thermal boundary conductance (TBC) of solid-solid interfaces lead to diverse values deviating from experimental measurements. In this paper, we propose a simple mechanism to evaluate the TBC contributed by phonons at room temperatures, where the microscopic structure of the interface layers between two dissimilar solids is treated as amorphous by taking into account the mismatches of the elastic modulus, the atomic masses, and the lattice spacing. Our theory explains well the observed magnitude of the TBCs across various solid-solid interfaces in the range from 10(7) to 10(9)W m(-2) K-1. The coordination number density and the energy transfer coefficient across interfaces are key parameters for determining the TBCs.

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