4.7 Article

Phosphor-in-glass with full-visible-spectrum emission based on ultra-low melting Sn-F-P-O glass pumped by NUV LED chips

Journal

JOURNAL OF ALLOYS AND COMPOUNDS
Volume 864, Issue -, Pages -

Publisher

ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2021.158671

Keywords

Phosphor in glass; White LEDs; Sn2+ activator; Full-visible-spectrum emission

Funding

  1. Scientific Research Funding Project from the Educational Department of Liaoning Province, China [J2020066]
  2. Research Grants Council of the Hong Kong Special Administrative Region, China [CityU 11218018]

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In this study, phosphor-in-glass (PiG) with full-visible-spectrum emission was successfully fabricated using a one-step sintering method. The Sn2+ ions exhibit intense blue-green emission characteristics under NUV excitation, and embedding phosphors can enhance their PL intensity.
Herein, the phosphor-in-glass (PiG) with full-visible-spectrum emission has been successfully fabricated by incorporating SrSi2O2N2: Eu2+ (SSON:Eu) and CaAlSiN3: Eu2+ (CASN:Eu) phosphors in ultra-low melting Sn-F-P-O glass using one-step sintering method. The Sn2+ ions show intense blue-green emission characteristics under the excitation of NUV chips, which are highly dependent on its co-ordination environment in Sn-F-P-O glass. Then, it was investigated in detail for the first time that fluoride from Sn-F-P-O glass substrate migrates and gathers around the embedded phosphors, which is closely related to the emission performance of Sn2+ activators in the PiG. Furthermore, the mechanism of enhancing the PL intensity of Sn2+ ions by embedded phosphors is proposed. As a result, the PiG with full-visible-spectrum emission can be achieved under 370 nm excitation. Importantly, the PiG pumped by NUV LED chips shows excellent-quality white-light with high CRI (Ra = 91) and lower CCT (4993 K). The WLED based on this PiG has been demonstrated as a promising candidate for solid warm light source in the future because of the excellent optoelectronic performance and easy-preparation process. (C) 2021 Published by Elsevier B.V.

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